Wafer cleaning method and system
AssigneeTokyo Electron Limited
InventorsJames Grootegoed, Ronald Nasman, Peter Delia
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Abstract
A wafer processing method and system are provided. The wafer processing system includes an isopropyl alcohol (IPA) evaporation system, an IPA condensation system, and a process chamber. The IPA evaporation system evaporates liquid IPA into IPA vapor. The IPA condensation system condenses a portion of the IPA vapor into distilled high purity liquid IPA. The process chamber rinses a semiconductor wafer in the process chamber using the distilled high purity liquid IPA, and displaces the distilled high purity liquid IPA using a remaining portion of the IPA vapor to dry the semiconductor wafer.
Claims9
A wafer processing system, comprising:
- a heater configured to evaporate liquid IPA into IPA vapor;
- a cooling system coupled to the heater, the cooling system configured to condense a portion of the IPA vapor into distilled high purity liquid IPA;
- and
- a process chamber coupled to the heater and the cooling system, the process chamber configured to receive the distilled high purity liquid IPA from the cooling system and a remaining portion of the IPA vapor from the heater, the process chamber configured to
- rinse a semiconductor wafer in the process chamber using the distilled high purity liquid IPA, and
- displace the distilled high purity liquid IPA using the remaining portion of the IPA vapor to dry the semiconductor wafer,
- wherein the heater and the cooling system are disposed outside the process chamber.
Dependencies are inferred from the claim text.