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US 2026/0107726 A1Published application
Method for processing substrate
AssigneeTokyo Electron Limited
InventorsPeter D'Elia, Ronald Nasman
Life of this patent
Estimating the term…
Abstract
A method for processing a substrate includes dispensing isopropyl alcohol (IPA) onto the substrate, providing the substrate into a processing chamber, pressurizing the processing chamber to a pressure above 5 MPa, removing the IPA on the substrate by displacing the IPA with liquid carbon dioxide (CO2), and removing the liquid CO2 as gaseous CO2 by venting the processing chamber.
Claims20
A method for processing a substrate, the method comprising:
- dispensing isopropyl alcohol (IPA) onto the substrate;
- providing the substrate into a processing chamber;
- pressurizing the processing chamber to a pressure above 5 MPa;
- removing the IPA on the substrate by displacing the IPA with liquid carbon dioxide (CO2);
- and
- removing the liquid CO2 as gaseous CO2 by venting the processing chamber.
3 more elements
A method for processing a substrate, the method comprising:
- providing the substrate into a processing chamber;
- dispensing isopropyl alcohol (IPA) onto the substrate;
- pressurizing the processing chamber with nitrogen (N2) gas to a pressure above 7 MPa;
- removing the IPA on the substrate by displacing the IPA with supercritical carbon dioxide (CO2);
- and
- removing the supercritical CO2 as gaseous CO2 by venting the processing chamber.
3 more elements
A method for processing a substrate, the method comprising:
- dispensing isopropyl alcohol (IPA) onto the substrate;
- providing the substrate into a processing chamber;
- pressurizing the processing chamber with carbon dioxide (CO2) gas to a supercritical pressure while dispensing IPA vapor into the processing chamber;
- removing the IPA on the substrate by displacing the IPA with supercritical carbon dioxide (CO2);
- and
- removing the supercritical CO2 as gaseous CO2 by venting the processing chamber.
3 more elements
Dependencies are inferred from the claim text.