Method for wafer backside polishing
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsKei-Wei Chen, Chih Hung Chen
Life of this patent
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Abstract
A method of cleaning and polishing a backside surface of a semiconductor wafer is provided. The method includes placing an abrasive brush, comprising an abrasive tape wound around an outer surface of a brush member of the abrasive brush, on the backside surface of the semiconductor wafer. The method also includes rotating the brush member to polish the backside surface of the semiconductor wafer by abrasive grains formed on the abrasive tape and to clean the backside surface of the semiconductor wafer by the brush member which is not covered by the abrasive tape.
Claims20
A cleaning module for semiconductor fabrication, comprising:
- a cleaning brush rotatable about a first rotation axis;
- and
- an abrasive brush positioned adjacent to the cleaning brush and rotatable about a second rotation axis that is parallel to the first rotation axis, wherein the abrasive brush comprises:
- a brush member, wherein the brush member is pliable and soft;
- and
- at least one abrasive tape wound around an outer surface of the brush member and comprising a plurality of abrasive grains.
An abrasive brush, comprising:
- a rotation shaft;
- a brush member, which is pliable, surrounding the rotation shaft;
- an abrasive tape wound around an outer surface of the brush member;
- and
- a plurality of pliable and soft protruding structures formed on the outer surface of the brush member.
A chemical mechanical polishing (CMP) system, comprising:
- a CMP module;
- and
- a first cleaning module, comprising:
- a cleaning brush;
- and
- an abrasive brush positioned adjacent to the cleaning brush, wherein the abrasive brush comprises a brush member and an abrasive tape formed on an outer surface of the brush member, the brush member is pliable and soft, and the abrasive tape comprises a plurality of abrasive grains.
Dependencies are inferred from the claim text.