Dry-type cleansing apparatus for wafers
AssigneeSemes Co., Ltd.
InventorsKwang Ryul Kim, Yun Sang Kim
Life of this patent
Estimating the term…
Abstract
A dry-type cleaning apparatus for wafers for dry cleaning of organic residues on a wafer surface includes a laser emitting laser light, an optical collimator receiving the laser light emitted from the laser and generating a first collimated laser light, an energy spreader uniformizing an energy distribution of the first collimated light received from the optical collimator, and a beam expander adjusting a diameter of the first collimated laser light passing through the energy spreader according to a diameter of a wafer to generate second laser light.
Claims13
A dry-type cleaning apparatus for wafers for dry cleaning of organic residues on a wafer surface, the dry-type cleaning apparatus comprising:
- a laser emitting laser light;
- a first energy spreader uniformizing an energy distribution of the laser light emitted from the laser;
- an optical collimator receiving the laser light passing through the first energy spreader and generating a first collimated laser light;
- an optical refractor refracting the first collimated laser light at least one time, an angle of each refraction being an angle of 90 degrees;
- a second energy spreader uniformizing an energy distribution of the first collimated laser light passing through the optical refractor;
- and
- a beam expander adjusting a diameter of the first collimated laser light passing through the second energy spreader according to a diameter of a wafer.
A dry-type cleaning apparatus for wafers for dry cleaning of organic residues on a wafer surface, the dry-type cleaning apparatus comprising:
- a laser emitting laser light;
- a first energy spreader uniformizing an energy distribution of the laser light emitted from the laser;
- an optical collimator receiving the laser light passing through the first energy spreader and generating a first collimated laser light;
- an optical refractor refracting the first collimated laser light by an angle of 90 degrees;
- a second energy spreader uniformizing an energy distribution of the first collimated laser light passing through the optical refractor;
- a beam expander adjusting a diameter of the first collimated laser light passing through the second energy spreader according to a diameter of a wafer to generate a second laser light;
- a cooling unit configured to cool the wafer heated by the second laser light;
- an air jetting part provided at a side of the wafer and configured to jet an inert gas to the surface of the wafer;
- and
- an air suction part provided opposite to the air jetting part, configured to suck the inert gas jetted by the air jetting part and the organic residues on the surface of the wafer, and having a narrower width than the air jetting part.
Dependencies are inferred from the claim text.