H10P 70/12
By dry cleaning only
Official title: {by dry cleaning only (H10P70/52 takes precedence)}
H10P70/12 (By dry cleaning only) appears on 650 US grants and 541 published applications in this corpus.
Search patents in H10P- Granted patents
- 650
- Published applications
- 541
- Assignees
- 270
- Inventors
- 1,642
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 5 | 0 |
| 1990 | 4 | 0 |
| 1991 | 11 | 0 |
| 1992 | 12 | 0 |
| 1993 | 16 | 0 |
| 1994 | 22 | 0 |
| 1995 | 15 | 0 |
| 1996 | 17 | 0 |
| 1997 | 13 | 0 |
| 1998 | 23 | 0 |
| 1999 | 29 | 0 |
| 2000 | 22 | 0 |
| 2001 | 28 | 15 |
| 2002 | 33 | 30 |
| 2003 | 28 | 33 |
| 2004 | 29 | 48 |
| 2005 | 24 | 40 |
| 2006 | 31 | 29 |
| 2007 | 18 | 23 |
| 2008 | 11 | 12 |
| 2009 | 14 | 12 |
| 2010 | 8 | 11 |
| 2011 | 8 | 8 |
| 2012 | 11 | 16 |
| 2013 | 10 | 9 |
| 2014 | 6 | 26 |
| 2015 | 17 | 20 |
| 2016 | 14 | 21 |
| 2017 | 17 | 23 |
| 2018 | 17 | 27 |
| 2019 | 22 | 24 |
| 2020 | 17 | 16 |
| 2021 | 14 | 20 |
| 2022 | 16 | 22 |
| 2023 | 14 | 19 |
| 2024 | 18 | 17 |
| 2025 | 12 | 14 |
| 2026 | 7 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Dry-type cleansing apparatus for wafers6 Oct 2026US 12,757,664 B2Semes Co., Ltd.
- Semiconductor processing preclean methods and apparatus6 Oct 2026US 12,757,665 B2ASM IP Holding B. V.
- Method and apparatus for dry-cleaning AlN heater for semiconductor fabrication equipment1 Sep 2026US 12,727,420 B2WONIK QNC Corporation
- Apparatus and method for removal of oxide and carbon from semiconductor films in a single processing chamber14 Jul 2026US 12,685,061 B2ASM IP Holding B. V.
- Substrate processing apparatus7 Jul 2026US 12,677,623 B2Semes Co., Ltd.
- Apparatus and method for removal of oxide and carbon from semiconductor films in a single processing chamber8 Oct 2026US 2026/0314290 A1ASM IP Holding B. V.
- Semiconductor processing preclean methods and apparatus17 Sep 2026US 2026/0282789 A1ASM IP Holding B. V.
- Etching method2 Jul 2026US 2026/0190883 A1Hitachi High-Tech Corporation
- Method for manufacturing wafer14 May 2026US 2026/0136864 A1SK Siltron Co., Ltd.
- Semiconductor stacks and processes thereof26 Mar 2026US 2026/0090293 A1Lam Research Corporation
Most cited
By later US patents
- Substrate processing method and substrate processing apparatus490US 6,620,251 B2Tokyo Electron Limited · 2003
- Plasma pre-clean module and process477US 9,299,557 B2ASM IP Holding B. V. · 2016
- Plasma pre-clean module and process474US 9,514,927 B2ASM IP Holding B. V. · 2016
- Surface treatment for silicon substrates423US 5,510,277 AAT&T Corp. · 1996
- Method for removing a film on a silicon layer surface421US 5,022,961 ADainippon Screen Mfg.Co., Ltd. · 1991