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US 2026/0136864 A1Published application
Method for manufacturing wafer
AssigneeSK Siltron Co., Ltd.
InventorJun Won PARK
Life of this patent
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Abstract
The present invention provides a method for manufacturing a wafer, comprising: a step of rinsing front and backside surfaces of the wafer, a step of securing hydrophobicity of the backside surface of the wafer; a step of improving particles distribution on the backside surface of the wafer, and a step of drying the front and backside surfaces of the wafer.
Claims9
A method for manufacturing a wafer, comprising:
- a step of rinsing front and backside surfaces of the wafer;
- a step of securing hydrophobicity of the backside surface of the wafer;
- a step of improving particles distribution on the backside surface of the wafer;
- and
- a step of drying the front and backside surfaces of the wafer.
2 more elements
Dependencies are inferred from the claim text.