H10P 70/15
By wet cleaning only
Official title: {by wet cleaning only (H10P70/52 takes precedence)}
H10P70/15 (By wet cleaning only) appears on 1,413 US grants and 1,405 published applications in this corpus.
Search patents in H10P- Granted patents
- 1,413
- Published applications
- 1,405
- Assignees
- 502
- Inventors
- 3,333
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 3 | 0 |
| 1978 | 2 | 0 |
| 1979 | 2 | 0 |
| 1980 | 3 | 0 |
| 1981 | 4 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 5 | 0 |
| 1988 | 4 | 0 |
| 1989 | 5 | 0 |
| 1990 | 5 | 0 |
| 1991 | 4 | 0 |
| 1992 | 7 | 0 |
| 1993 | 13 | 0 |
| 1994 | 20 | 0 |
| 1995 | 16 | 0 |
| 1996 | 23 | 0 |
| 1997 | 32 | 0 |
| 1998 | 44 | 0 |
| 1999 | 67 | 0 |
| 2000 | 56 | 0 |
| 2001 | 66 | 22 |
| 2002 | 79 | 97 |
| 2003 | 75 | 71 |
| 2004 | 39 | 108 |
| 2005 | 48 | 91 |
| 2006 | 47 | 94 |
| 2007 | 46 | 61 |
| 2008 | 34 | 62 |
| 2009 | 35 | 38 |
| 2010 | 34 | 41 |
| 2011 | 32 | 35 |
| 2012 | 34 | 48 |
| 2013 | 30 | 43 |
| 2014 | 37 | 56 |
| 2015 | 38 | 37 |
| 2016 | 43 | 53 |
| 2017 | 37 | 64 |
| 2018 | 42 | 60 |
| 2019 | 38 | 56 |
| 2020 | 63 | 41 |
| 2021 | 45 | 43 |
| 2022 | 23 | 40 |
| 2023 | 29 | 49 |
| 2024 | 37 | 45 |
| 2025 | 30 | 27 |
| 2026 | 31 | 23 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Apparatus and method for dispensing treatment liquid29 Sep 2026US 12,751,239 B2Semes Co., Ltd.
- Method of cleaning silicon wafer, method of manufacturing silicon wafer, and silicon wafer22 Sep 2026US 12,745,582 B2Shin-Etsu Handotai Co., Ltd.
- Semiconductor devices and methods of manufacture22 Sep 2026US 12,745,583 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Wafer cleaning method and system using heated functional plate22 Sep 2026US 12,745,585 B2Tokyo Electron Limited
- Substrate processing method and substrate processing apparatus25 Aug 2026US 12,721,079 B2Tokyo Electron Limited
- Sic wafer and sic epitaxial wafer8 Oct 2026US 2026/0313999 A1Resonac Corporation
- Method for cleaning semiconductor wafer1 Oct 2026US 2026/0305217 A1Sumco Corporation
- Substrate processing apparatus and substrate processing method24 Sep 2026US 2026/0293584 A1SCREEN Holdings Co., Ltd.
- Systems and methods for metallic deionization17 Sep 2026US 2026/0282790 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Brush nodule with ribbed surface20 Aug 2026US 2026/0241420 A1Tcnv, LLC
Most cited
By later US patents
- Substrate processing method, substrate processing apparatus, and program storage medium523US 8,020,315 B2Tokyo Electron Limited · 2011
- Substrate treatment method and substrate treatment apparatus473US 9,698,031 B2SCREEN Holdings Co., Ltd. · 2017
- Method of producing silicon thin film, method of constructing SOI substrate and semiconductor device368US 6,653,209 B1Canon Kabushiki Kaisha · 2003
- Method of preventing surface roughening during hydrogen prebake of SiGe substrates234US 6,958,286 B2International Business Machines Corporation · 2005
- Semiconductor wafer cleaning system181US 5,656,097 AVerteq, Inc. · 1997