Wafer cleaning method and system using heated functional plate
AssigneeTokyo Electron Limited
InventorsPeter Delia, Ronald Nasman
Life of this patent
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Abstract
A wafer processing method and system are provided. The wafer processing system includes a controller configured to control a dispense nozzle of the wafer processing system to dispense distilled IPA liquid onto a semiconductor wafer in a processing space between two plates of the wafer processing system. The controller is further configured to control one or more heating elements of one of the two plates to heat the one of the two plates to vaporize the distilled IPA liquid into IPA vapor, and control the dispense nozzle to dispense a gas into the processing space to dry the semiconductor wafer.
Claims10
A wafer processing system, comprising:
- two plates, between which a process space is formed, wherein the two plates comprise heaters;
- a dispense nozzle configured to dispense distilled isopropyl alcohol (IPA) liquid onto a semiconductor wafer in the processing space and configured to dispense a gas into the processing space to dry the semiconductor wafer;
- and
- a controller configured to
- control the dispense nozzle to dispense the distilled IPA liquid onto the semiconductor wafer,
- control one or more heaters of one of the two plates to heat the one of the two plates to vaporize the distilled IPA liquid into IPA vapor, and
- control the dispense nozzle to dispense the gas into the processing space to dry the semiconductor wafer,
- wherein the dispense nozzle is located under the processing space.
Dependencies are inferred from the claim text.