Substrate processing method, substrate processing apparatus, and program storage medium

A substrate processing method for drying a substrate, by using a fluid heated by a heating apparatus including an inlet, an outlet, a path which connects the inlet and outlet and includes a temperature sensor and a plurality of heating mechanisms, where each mechanism includes a heating element, for heating the fluid flowing through the path, the method comprising:

• a first step of supplying a gas and a processing liquid, into the heating apparatus, from the inlet forming a mixed fluid, heating the mixed fluid containing the gas and the processing liquid, in the heating apparatus, as well as supplying the heated mixed fluid discharged from the outlet of the heating apparatus, into a processing chamber in which the substrate is placed;
• and
• a second step of supplying a second gas, into the heating apparatus, from the inlet, heating the gas, in the heating apparatus, as well as supplying the heated gas discharged from the outlet of the heating apparatus, into the processing chamber,
• wherein, in the first step, a heat output of at least one of the one or more heating mechanisms of the heating apparatus is kept at a preset constant value for a period of time during which a predetermined time passes after the start of supplying the processing liquid into the heating apparatus, and
• wherein, in the second step, the heat outputs of the one or more heating mechanisms of the heating apparatus are determined, under feed back control involving the temperature sensor, in order to set the temperature of the gas, during or after the heating process, at a preset value.