H10P 70/50
Cleaning of wafers, substrates or parts of devices: characterised by the part
Official title: {characterised by the part to be cleaned}
H10P70/50 (Cleaning of wafers, substrates or parts of devices: characterised by the part) appears on 522 US grants and 714 published applications in this corpus.
Search patents in H10P- Granted patents
- 522
- Published applications
- 714
- Assignees
- 178
- Inventors
- 1,427
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 3 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 3 | 0 |
| 2001 | 4 | 5 |
| 2002 | 10 | 11 |
| 2003 | 8 | 16 |
| 2004 | 13 | 18 |
| 2005 | 11 | 18 |
| 2006 | 5 | 26 |
| 2007 | 11 | 31 |
| 2008 | 10 | 41 |
| 2009 | 9 | 30 |
| 2010 | 14 | 25 |
| 2011 | 24 | 19 |
| 2012 | 15 | 19 |
| 2013 | 24 | 25 |
| 2014 | 22 | 32 |
| 2015 | 18 | 38 |
| 2016 | 21 | 31 |
| 2017 | 37 | 36 |
| 2018 | 18 | 35 |
| 2019 | 32 | 31 |
| 2020 | 31 | 43 |
| 2021 | 30 | 44 |
| 2022 | 31 | 35 |
| 2023 | 33 | 35 |
| 2024 | 24 | 36 |
| 2025 | 33 | 21 |
| 2026 | 22 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Wafer cleaning method and system using heated functional plate22 Sep 2026US 12,745,585 B2Tokyo Electron Limited
- Point of use solvent mixing for film removal11 Aug 2026US 12,704,785 B2Tokyo Electron Limited
- Wafer processing apparatus providing cleaning and etching units with separate shrouds and enclosing separate spinner tables4 Aug 2026US 12,701,942 B2Disco Corporation
- Semiconductor fabricating system having hybrid brush assembly28 Jul 2026US 12,696,706 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Purge system to clean wafer backside for ring susceptor21 Jul 2026US 12,690,405 B2APPLIED Materials.Inc.
- Method of cleaning semiconductor wafer, method of producing semiconductor wafer, and semiconductor wafer6 Aug 2026US 2026/0231712 A1Sumco Corporation
- Mitigation of Capillary Pattern Collapse in Supercritical Dry30 Jul 2026US 2026/0223620 A1Tokyo Electron Limited
- Substrate processing method and substrate processing apparatus23 Jul 2026US 2026/0215187 A1Tokyo Electron Limited
- Wafer backside deposition cleaning23 Jul 2026US 2026/0215197 A1APPLIED Materials.Inc.
- Laser cleaning apparatus and laser cleaning method thereof23 Jul 2026US 2026/0215204 A1MainType Opto-Electronics Technology Co., LTD.
Most cited
By later US patents
- Low temperature system and method for CVD copper removal383US 5,897,379 ASharp Kabushiki Kaisha · 1999
- Bevel etcher with gap control345US 7,858,898 B2Lam Research Corporation · 2010
- Electroless plating liquid and semiconductor device258US 6,717,189 B2Ebara Corporation · 2004
- Method and apparatus for selective removal of material from wafer alignment marks66US 6,103,636 AMicron Technology, Inc. · 2000
- Method of forming a copper oxide film to etch a copper surface evenly53US 6,261,953 B1Kabushiki Kaisha Toshiba · 2001