H10P 70/56
Cleaning of wafer backside
Official title: {Cleaning of wafer backside}
H10P70/56 (Cleaning of wafer backside) appears on 243 US grants and 305 published applications in this corpus.
Search patents in H10P- Granted patents
- 243
- Published applications
- 305
- Assignees
- 95
- Inventors
- 683
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 3 | 4 |
| 2002 | 9 | 11 |
| 2003 | 6 | 12 |
| 2004 | 11 | 9 |
| 2005 | 9 | 10 |
| 2006 | 4 | 11 |
| 2007 | 6 | 10 |
| 2008 | 4 | 16 |
| 2009 | 4 | 9 |
| 2010 | 6 | 15 |
| 2011 | 13 | 6 |
| 2012 | 5 | 6 |
| 2013 | 8 | 9 |
| 2014 | 8 | 11 |
| 2015 | 9 | 20 |
| 2016 | 9 | 15 |
| 2017 | 16 | 19 |
| 2018 | 8 | 13 |
| 2019 | 18 | 13 |
| 2020 | 11 | 19 |
| 2021 | 7 | 12 |
| 2022 | 15 | 13 |
| 2023 | 9 | 11 |
| 2024 | 11 | 21 |
| 2025 | 15 | 6 |
| 2026 | 13 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wafer cleaning method and system using heated functional plate22 Sep 2026US 12,745,585 B2Tokyo Electron Limited
- Wafer processing apparatus providing cleaning and etching units with separate shrouds and enclosing separate spinner tables4 Aug 2026US 12,701,942 B2Disco Corporation
- Semiconductor fabricating system having hybrid brush assembly28 Jul 2026US 12,696,706 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Purge system to clean wafer backside for ring susceptor21 Jul 2026US 12,690,405 B2APPLIED Materials.Inc.
- Substrate cleaning device and substrate cleaning method14 Jul 2026US 12,685,062 B2SCREEN Holdings Co., Ltd.
- Method of cleaning semiconductor wafer, method of producing semiconductor wafer, and semiconductor wafer6 Aug 2026US 2026/0231712 A1Sumco Corporation
- Method for manufacturing wafer14 May 2026US 2026/0136864 A1SK Siltron Co., Ltd.
- Method of manufacturing semiconductor device12 Mar 2026US 2026/0076154 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Wafer cleaning method and apparatus1 Jan 2026US 2026/0005012 A1Shanghai Huali Microelectronics Corporation
- Wafer cleaning method and system using heated functional plate16 Oct 2025US 2025/0323035 A1Tokyo Electron Limited
Most cited
By later US patents
- Bevel etcher with gap control345US 7,858,898 B2Lam Research Corporation · 2010
- Electroless plating liquid and semiconductor device258US 6,717,189 B2Ebara Corporation · 2004
- Method and apparatus for selective removal of material from wafer alignment marks66US 6,103,636 AMicron Technology, Inc. · 2000
- Method of forming a copper oxide film to etch a copper surface evenly53US 6,261,953 B1Kabushiki Kaisha Toshiba · 2001
- Substrate-cleaning method and substrate-cleaning solution49US 6,423,148 B1NEC Corporation · 2002