Electroless plating liquid and semiconductor device
AssigneeEbara Corporation
InventorsHiroaki Inoue, Kenji Nakamura, Moriji Matsumoto
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Abstract
The present invention relates to an electroless-plating liquid useful for forming a protective film for selectively protecting surface of exposed interconnects of a semiconductor device which has an embedded interconnect structure formed by an electric conductor, such as copper or silver, embedded in fine recesses for interconnects formed in a surface of a semiconductor substrate, and also to a semiconductor device in which surfaces of exposed interconnects are selectively protected with a protective film. The electroless-plating liquid contains cobalt ions, a complexing agent and a reducing agent containing no alkali metal.
Claims9
A semiconductor device comprising:
- an interconnect made of copper, copper alloy, silver, or silver alloy, embedded in a trench in a surface of an insulating film, wherein said trench is covered by a barrier layer;
- and
- a protective film having a thickness in a range of from 0.1 nm to 500 nm, said protective film selectively covering an exposed surface of said interconnect, and said protective film being formed by an electroless-plating process using an electroless-plating liquid without using palladium, said electroless-plating liquid comprising:
- (i) cobalt ions;
- (ii) a complexing agent;
- and
- (iii) an alkylamine borane that is free from alkali metal.
A semiconductor device comprising:
- an interconnect made of copper, copper alloy, silver, or silver alloy, embedded in a trench in a surface of an insulating film, wherein said trench is covered by a barrier layer;
- and
- a protective film having a thickness in a range of from 0.1 nm to 500 nm, said protective film selectively covering an exposed surface of said interconnect, and said protective film being formed by an electroless-plating process using an electroless-plating liquid without using palladium, said electroless-plating liquid comprising:
- (i) cobalt ions;
- (ii) a complexing agent;
- (iii) a compound containing a refractory metal;
- and
- (iv) an alkylamine borane that is free from alkali metal.
Dependencies are inferred from the claim text.