H10P 70/20
Cleaning during device manufacture
Official title: {Cleaning during device manufacture}
H10P70/20 (Cleaning during device manufacture) appears on 5,360 US grants and 6,637 published applications in this corpus.
Search patents in H10P- Granted patents
- 5,360
- Published applications
- 6,637
- Assignees
- 895
- Inventors
- 10,818
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 5 | 0 |
| 1983 | 4 | 0 |
| 1984 | 2 | 0 |
| 1985 | 6 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 5 | 0 |
| 1991 | 5 | 0 |
| 1992 | 10 | 0 |
| 1993 | 14 | 0 |
| 1994 | 19 | 0 |
| 1995 | 26 | 0 |
| 1996 | 17 | 0 |
| 1997 | 35 | 0 |
| 1998 | 43 | 0 |
| 1999 | 65 | 0 |
| 2000 | 95 | 0 |
| 2001 | 125 | 54 |
| 2002 | 133 | 148 |
| 2003 | 141 | 164 |
| 2004 | 136 | 199 |
| 2005 | 121 | 206 |
| 2006 | 105 | 260 |
| 2007 | 117 | 262 |
| 2008 | 120 | 255 |
| 2009 | 121 | 209 |
| 2010 | 178 | 207 |
| 2011 | 156 | 161 |
| 2012 | 161 | 209 |
| 2013 | 161 | 223 |
| 2014 | 161 | 240 |
| 2015 | 206 | 308 |
| 2016 | 251 | 332 |
| 2017 | 276 | 325 |
| 2018 | 264 | 329 |
| 2019 | 275 | 348 |
| 2020 | 308 | 379 |
| 2021 | 305 | 334 |
| 2022 | 249 | 371 |
| 2023 | 256 | 342 |
| 2024 | 257 | 310 |
| 2025 | 251 | 278 |
| 2026 | 161 | 184 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Composition and method for treating substrate6 Oct 2026US 12,753,342 B2FUJIFILM Corporation
- Cleaning solution, method for cleaning substrate, and method for manufacturing semiconductor6 Oct 2026US 12,753,366 B2Tokyo Ohka Kogyo.Co., Ltd.
- Wet cleaning tool and method6 Oct 2026US 12,757,668 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Enhanced dry desmear equipment with protective film peeling capability for integrated circuits29 Sep 2026US 12,749,660 B2Intel Corporation
- Systems and methods for recovering organic contaminants from semiconducting wafers29 Sep 2026US 12,749,667 B2Elemental Scientific, Inc.
- Multi-gate device fabrication and structures thereof8 Oct 2026US 2026/0313936 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Doping profile for strained source/drain region8 Oct 2026US 2026/0313975 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method for forming source/drain contacts8 Oct 2026US 2026/0314054 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Composition for wet etching and manufacturing method of semiconductor device using the composition8 Oct 2026US 2026/0314286 A1Samsung Electronics Co., Ltd.
- Methods of separating semiconductor dies8 Oct 2026US 2026/0314289 A1
Most cited
By later US patents
- Plasma treatment method and apparatus581US 5,242,539 AHitachi, Ltd. · 1993
- Selective formation of metallic films on metallic surfaces573US 8,956,971 B2ASM International N.V. · 2015
- Methods and apparatus for passivating a substrate in a plasma reactor567US 5,968,275 ALam Research Corporation · 1999
- Apparatus for efficient removal of halogen residues from etched substrates558US 8,293,016 B2APPLIED Materials.Inc. · 2012
- Plasma pre-treating surfaces for atomic layer deposition548US 7,498,242 B2ASM America, Inc. · 2009