Wet cleaning tool and method

A nozzle disposed inside a substrate processing chamber of a semiconductor apparatus, the nozzle comprising:

• a gas passageway in communication with a carrier gas source of the semiconductor apparatus to receive a carrier gas provided by the carrier gas source and sprayed onto a semiconductor wafer, wherein the gas passageway comprises multiple elongated gas passage branches, each elongated gas passage branch has a first end connected to a main gas passage and a second end connected to a gas opening;
• a fluid passageway in communication with a fluid source of the semiconductor apparatus to receive a fluid provided by the fluid source and sprayed onto the semiconductor wafer, wherein the fluid passageway comprises multiple elongated fluid passage branches, each elongated fluid passage branch has a first end connected to a main fluid passage and a second end connected to a fluid opening;
• and
• a programmable controller configured to control supply modes of the multiple elongated gas passage branches and the multiple elongated fluid passage branches independently,
• wherein the carrier gas and the fluid are sprayed simultaneously onto the semiconductor wafer so that the carrier gas pushes the fluid outwards on the semiconductor wafer,
• wherein the multiple elongated gas passage branches and the multiple elongated fluid passage branches are arranged in an interwoven honeycomb pattern, and
• wherein the programmable controller adjusts a distribution of the carrier gas based on a pattern density of structures already on the semiconductor wafer.

A semiconductor apparatus comprising:

• a chamber configured to receive a semiconductor wafer during a semiconductor fabrication process;
• and
• a semiconductor cleaning apparatus comprising:
• a carrier gas source configured to provide a carrier gas;
• a first inlet in communication with the carrier gas source and configured to receive the carrier gas;
• a second inlet configured to receive one or more fluids;
• and
• a first nozzle connected with the first inlet and a second nozzle connected with the second inlet, the first nozzle being configured to spray the carrier gas onto the semiconductor wafer and the second nozzle being configured to spray the one or more fluids onto the semiconductor wafer, wherein the carrier gas and the one or more fluids are sprayed simultaneously onto the semiconductor wafer so that the carrier gas pushes the one or more fluids outwards on the semiconductor wafer;
• and
• a gas passageway connected to the first inlet, and a fluid passageway connected to the second inlet, wherein the gas passageway comprises multiple elongated gas passage branches and the fluid passageway comprises multiple elongated fluid passage branches;
• and
• a programmable controller configured to control supply modes of the multiple elongated gas passage branches and the multiple elongated fluid passage branches independently,
• wherein each elongated gas passage branch has a first end connected to a main gas passage and a second end connected to a gas opening,
• each of the multiple elongated fluid passage branches has a first end connected to a main fluid passage and a second end connected to a fluid opening, wherein the multiple elongated gas passage branches and the multiple elongated fluid passage branches are arranged in an interwoven honeycomb pattern, and
• the programmable controller adjusts a distribution of the carrier gas based on a pattern density of the one or more fluids previously sprayed onto the semiconductor wafer.