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AssigneeIntel Corporation
InventorsAla Omer, Peumie Abeyratne Kuragama, Jieying Kong, Wendy Lin, Ao Wang
Estimating the term…
This disclosure describes designs and methods for via cleaning, peeling protective film, and providing mild surface roughening and cleaning of a computer chip. A system may include a first electrode configured to generate plasma associated with cleaning vias by etching a residual material associated with smearing; an electrostatic stage configured to generate an electrostatic force associated with peeling the dielectric protective film from the semiconductor; and a stage on which the semiconductor is positioned while the electrostatic stage peels the dielectric protective film from the semiconductor, wherein the plasma is further associated with roughening a surface of the semiconductor after peeling the dielectric protective film from the semiconductor.
A system for peeling a dielectric protective film from a semiconductor, the system comprising:
A system for peeling a dielectric protective film from a semiconductor, the system comprising:
A method for peeling a dielectric protective film from a semiconductor, the method comprising:
Dependencies are inferred from the claim text.