H10P 70/23
During, before or after processing of insulating materials
Official title: {during, before or after processing of insulating materials}
H10P70/23 (During, before or after processing of insulating materials) appears on 2,375 US grants and 2,885 published applications in this corpus.
Search patents in H10P- Granted patents
- 2,375
- Published applications
- 2,885
- Assignees
- 498
- Inventors
- 5,363
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 3 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 4 | 0 |
| 1991 | 3 | 0 |
| 1992 | 2 | 0 |
| 1993 | 5 | 0 |
| 1994 | 5 | 0 |
| 1995 | 9 | 0 |
| 1996 | 7 | 0 |
| 1997 | 8 | 0 |
| 1998 | 12 | 0 |
| 1999 | 22 | 0 |
| 2000 | 43 | 0 |
| 2001 | 57 | 31 |
| 2002 | 63 | 75 |
| 2003 | 71 | 75 |
| 2004 | 75 | 96 |
| 2005 | 67 | 111 |
| 2006 | 59 | 144 |
| 2007 | 65 | 148 |
| 2008 | 58 | 123 |
| 2009 | 70 | 96 |
| 2010 | 90 | 103 |
| 2011 | 78 | 74 |
| 2012 | 75 | 75 |
| 2013 | 70 | 87 |
| 2014 | 73 | 100 |
| 2015 | 86 | 130 |
| 2016 | 110 | 131 |
| 2017 | 130 | 140 |
| 2018 | 110 | 126 |
| 2019 | 119 | 136 |
| 2020 | 132 | 167 |
| 2021 | 126 | 137 |
| 2022 | 110 | 139 |
| 2023 | 94 | 144 |
| 2024 | 96 | 132 |
| 2025 | 106 | 103 |
| 2026 | 58 | 62 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Wet cleaning tool and method6 Oct 2026US 12,757,668 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Enhanced dry desmear equipment with protective film peeling capability for integrated circuits29 Sep 2026US 12,749,660 B2Intel Corporation
- Etching method and etching apparatus15 Sep 2026US 12,740,357 B2SCREEN Holdings Co., Ltd.
- Semiconductor cleaning using plasma-free precursors25 Aug 2026US 12,721,080 B2APPLIED Materials.Inc.
- Integration solution for NAND deep contact gap fill25 Aug 2026US 12,721,123 B2APPLIED Materials.Inc.
- Composition for wet etching and manufacturing method of semiconductor device using the composition8 Oct 2026US 2026/0314286 A1Samsung Electronics Co., Ltd.
- Methods of separating semiconductor dies8 Oct 2026US 2026/0314289 A1
- Laser ablation of backside dielectric to adjust substrate warpage1 Oct 2026US 2026/0305204 A1APPLIED Materials.Inc.
- Surface treatment agent, silicon compound, and method for suppressing pattern collapse when substrate surface is cleaned with cleaning liquid24 Sep 2026US 2026/0286256 A1Tokyo Ohka Kogyo.Co., Ltd.
- Novel interconnect structure24 Sep 2026US 2026/0293635 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Plasma pre-treating surfaces for atomic layer deposition548US 7,498,242 B2ASM America, Inc. · 2009
- Adsorption based material removal process539US 8,043,972 B1Novellus Systems, Inc. · 2011
- Integrated processing of porous dielectric, polymer-coated substrates and epoxy within a multi-chamber vacuum system confirmation524US 9,171,714 B2APPLIED Materials.Inc. · 2015
- Integration of ALD tantalum nitride for copper metallization495US 7,049,226 B2APPLIED Materials.Inc. · 2006
- Germanium oxide pre-clean module and process418US 9,474,163 B2ASM IP Holding B. V. · 2016