H10P 70/234
The processing being the formation of vias or contact holes
Official title: {the processing being the formation of vias or contact holes}
H10P70/234 (The processing being the formation of vias or contact holes) appears on 1,534 US grants and 1,756 published applications in this corpus.
Search patents in H10P- Granted patents
- 1,534
- Published applications
- 1,756
- Assignees
- 352
- Inventors
- 3,357
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 3 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 4 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 5 | 0 |
| 1994 | 5 | 0 |
| 1995 | 7 | 0 |
| 1996 | 7 | 0 |
| 1997 | 8 | 0 |
| 1998 | 12 | 0 |
| 1999 | 19 | 0 |
| 2000 | 35 | 0 |
| 2001 | 55 | 31 |
| 2002 | 53 | 69 |
| 2003 | 67 | 69 |
| 2004 | 68 | 85 |
| 2005 | 61 | 97 |
| 2006 | 53 | 114 |
| 2007 | 55 | 119 |
| 2008 | 43 | 92 |
| 2009 | 58 | 72 |
| 2010 | 71 | 79 |
| 2011 | 62 | 54 |
| 2012 | 59 | 44 |
| 2013 | 53 | 57 |
| 2014 | 51 | 43 |
| 2015 | 43 | 81 |
| 2016 | 64 | 51 |
| 2017 | 56 | 57 |
| 2018 | 52 | 55 |
| 2019 | 56 | 62 |
| 2020 | 57 | 72 |
| 2021 | 53 | 71 |
| 2022 | 60 | 70 |
| 2023 | 49 | 71 |
| 2024 | 53 | 73 |
| 2025 | 48 | 44 |
| 2026 | 22 | 24 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Semiconductor device and method of manufacture25 Aug 2026US 12,721,126 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Washing solution and washing method for semiconductor substrate16 Jun 2026US 12,660,545 B2FUJIFILM Corporation
- Interconnect structure16 Jun 2026US 12,660,585 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Novel interconnect structure24 Sep 2026US 2026/0293635 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate treating method and substrate treating apparatus, and method for manufacturing semiconductor apparatus and semiconductor manufacturing apparatus13 Aug 2026US 2026/0233249 A1SCREEN Holdings Co., Ltd.
- Film forming method and semiconductor manufacturing apparatus30 Jul 2026US 2026/0218374 A1Tokyo Electron Limited
- Substrate processing method and substrate processing apparatus16 Jul 2026US 2026/0201547 A1Tokyo Electron Limited
- Gradient etching with microwave oxidation16 Jul 2026US 2026/0206556 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Plasma pre-treating surfaces for atomic layer deposition548US 7,498,242 B2ASM America, Inc. · 2009
- Adsorption based material removal process539US 8,043,972 B1Novellus Systems, Inc. · 2011
- Integration of ALD tantalum nitride for copper metallization495US 7,049,226 B2APPLIED Materials.Inc. · 2006
- Low temperature system and method for CVD copper removal383US 5,897,379 ASharp Kabushiki Kaisha · 1999
- Low-temperature in-situ dry cleaning process for semiconductor wafer359US 5,403,434 ATexas Instruments Incorporated · 1995