Substrate treating method and substrate treating apparatus, and method for manufacturing semiconductor apparatus and semiconductor manufacturing apparatus

A method for manufacturing a semiconductor apparatus including a treatment of a substrate in which a stacked body is provided on a surface, the stacked body including layers in which a layer to be protected that is to be protected from etching and a layer to be etched that is to be etched are alternately stacked, the method for manufacturing the semiconductor apparatus comprising:

• selectively forming a self-assembled monolayer on at least a surface of the layer to be protected;
• and
• selectively etching the layer to be etched by using the self-assembled monolayer as a protective layer,
• wherein forming of the self-assembled monolayer includes
• generating a dispersion liquid in which water is uniformly dispersed in an organic solvent as a main solvent,
• adding a material containing a molecule that has a functional group exhibiting hydrolysis reactivity and allows formation of the self-assembled monolayer to the dispersion liquid, and causing a hydrolysis reaction of the water dispersed in the dispersion liquid and the functional group to generate a treating liquid containing the molecule having a hydroxyl group and in which the molecule having the hydroxyl group exists without being aggregated, and
• forming the self-assembled monolayer by supplying the treating liquid to the surface of the substrate, and
• the dispersion liquid is generated by mixing the organic solvent and the water while applying an ultrasonic wave or by mixing the organic solvent and the water and then applying an ultrasonic wave, and
• the treating liquid is generated in a state where no ultrasonic wave is applied to the dispersion liquid.

A substrate treating apparatus that forms a self-assembled monolayer on a surface of a substrate, the substrate treating apparatus comprising:

• a treating liquid tank that generates a treating liquid containing a molecule that allows formation of the self-assembled monolayer;
• an ultrasonic wave transducer;
• and
• a treating liquid nozzle that supplies the treating liquid generated by the treating liquid tank to the surface of the substrate to form the self-assembled monolayer,
• wherein the treating liquid tank generates a dispersion liquid in which water is uniformly dispersed in an organic solvent as a main solvent, further adds a material containing a molecule that has a functional group exhibiting hydrolysis reactivity and allows formation of the self-assembled monolayer to the dispersion liquid, and causes a hydrolysis reaction of the water dispersed in the dispersion liquid and the functional group to generate the treating liquid containing the molecule having a hydroxyl group and in which the molecule having the hydroxyl group exists without being aggregated, and
• the ultrasonic wave transducer applies an ultrasonic wave when or after the organic solvent and the water are mixed in the treating liquid tank to generate the dispersion liquid.

A semiconductor manufacturing apparatus for performing a treatment of a substrate in which a stacked body is provided on a surface, the stacked body including layers in which a layer to be protected that is to be protected from etching and a layer to be etched that is to be etched are alternately stacked,

• the semiconductor manufacturing apparatus comprising:
• a treating liquid tank that generates a treating liquid containing a molecule that allows formation of a self-assembled monolayer;
• an ultrasonic wave transducer;
• a treating liquid nozzle that supplies the treating liquid generated by the treating liquid generation portion to the surface of the substrate to form the self-assembled monolayer;
• and
• an etching nozzle that selectively etches and removes the layer to be etched by using the self-assembled monolayer as a protective layer,
• wherein the treating liquid tank generates a dispersion liquid in which water is uniformly dispersed in an organic solvent as a main solvent, further adds a material containing a molecule that has a functional group exhibiting hydrolysis reactivity and allows formation of the self-assembled monolayer to the dispersion liquid, and causes a hydrolysis reaction of the water dispersed in the dispersion liquid and a functional group to generate the treating liquid containing the molecule having a hydroxyl group and in which the molecule having the hydroxyl group exists without being aggregated, and
• the ultrasonic wave transducer applies an ultrasonic wave when or after the organic solvent and the water are mixed in the treating liquid tank to generate the dispersion liquid.

A semiconductor manufacturing apparatus for performing a treatment of a substrate in which a stacked body is provided on a surface, the stacked body including layers in which a layer to be protected that is to be protected from etching and a layer to be etched that is to be etched are alternately stacked,

• the semiconductor manufacturing apparatus comprising:
• a substrate treatment unit that selectively forms a self-assembled monolayer on at least a surface of the layer to be protected;
• and
• an etching treatment unit that selectively etches and removes the layer to be etched by using the self-assembled monolayer as a protective layer,
• wherein the substrate treatment unit includes
• a treating liquid tank that generates a treating liquid containing a molecule that allows formation of the self-assembled monolayer,
• an ultrasonic wave transducer, and
• a treating liquid nozzle that supplies the treating liquid generated by the treating liquid tank to the surface of the substrate to form the self-assembled monolayer,
• the treating liquid generation portion generates a dispersion liquid in which water is uniformly dispersed in an organic solvent as a main solvent, further adds a material containing a molecule that has a functional group exhibiting hydrolysis reactivity and allows formation of the self-assembled monolayer to the dispersion liquid, and causes a hydrolysis reaction of the water dispersed in the dispersion liquid and the functional group to generate the treating liquid containing the molecule having a hydroxyl group and in which the molecule having the hydroxyl group exists without being aggregated, and
• the ultrasonic wave transducer applies an ultrasonic wave when or after the organic solvent and the water are mixed in the treating liquid tank to generate the dispersion liquid.