H10P 70/237
The processing being a planarisation of insulating layers
Official title: {the processing being a planarisation of insulating layers}
H10P70/237 (The processing being a planarisation of insulating layers) appears on 178 US grants and 245 published applications in this corpus.
Search patents in H10P- Granted patents
- 178
- Published applications
- 245
- Assignees
- 89
- Inventors
- 492
- Latest grant
- 26 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 3 | 0 |
| 2000 | 7 | 0 |
| 2001 | 2 | 0 |
| 2002 | 4 | 3 |
| 2003 | 2 | 4 |
| 2004 | 1 | 3 |
| 2005 | 3 | 5 |
| 2006 | 1 | 4 |
| 2007 | 2 | 3 |
| 2008 | 3 | 6 |
| 2009 | 1 | 2 |
| 2010 | 2 | 2 |
| 2011 | 2 | 3 |
| 2012 | 0 | 5 |
| 2013 | 1 | 4 |
| 2014 | 5 | 12 |
| 2015 | 7 | 9 |
| 2016 | 8 | 18 |
| 2017 | 13 | 16 |
| 2018 | 14 | 15 |
| 2019 | 11 | 20 |
| 2020 | 11 | 19 |
| 2021 | 21 | 17 |
| 2022 | 11 | 20 |
| 2023 | 9 | 21 |
| 2024 | 9 | 12 |
| 2025 | 14 | 13 |
| 2026 | 9 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
- Post clean treatment composition comprising an organic acid and hydroxylamine137US 5,981,454 AEKC Technology, Inc. · 1999
- Selective cleaning process for fabricating a semiconductor device93US 5,478,436 AMotorola, Inc. · 1995
- Method for polish planarizing a semiconductor substrate by using a boron nitride polish stop88US 5,064,683 AMotorola, Inc. · 1991
- Post clean treatment85US 6,156,661 AEKC Technology, Inc. · 2000
- Cleaning composition containing tetraalkylammonium salt and use thereof in semiconductor fabrication77US 5,855,811 AMicron Technology, Inc. · 1999