Water-based, high-efficiency chemical reagent for substrate surface particle removal
AssigneeApplied Materials, Inc.
InventorsHong YAN, Raymond Hoiman HUNG, Ying WANG, Xundong DAI
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Abstract
Embodiments of the disclosure provided herein include systems and methods for cleaning semiconductor substrates The method includes rotating a substrate disposed on a substrate support, spraying a front side of the substrate using a cleaning agent including one or more chelating agents through a front side nozzle assembly disposed above the substrate support, and spraying a back side of the substrate using the cleaning agent through a back side dispenser assembly disposed below the substrate support.
Claims19
A method of cleaning a substrate, comprising:
- rotating a substrate support configured to support a substrate;
- and
- spraying a front side of the substrate from above the substrate using a cleaning agent comprising one or more chelating agents through a front side nozzle assembly.
A method of cleaning a substrate, comprising:
- rotating a substrate support supporting a substrate;
- spraying a front side of the substrate from above the substrate using a cleaning agent comprising one or more chelating agents through a front side nozzle assembly;
- spraying a back side of the substrate using the cleaning agent;
- applying megasonic energy to the substrate;
- and
- drying the substrate by dispensing isopropyl alcohol.
Dependencies are inferred from the claim text.