C09G
Polishing compositions
Official title: POLISHING COMPOSITIONS (French polish C09F11/00); SKI WAXES
C09G (Polishing compositions) appears on 2,883 US grants and 3,713 published applications in this corpus.
Search patents in C09G- Granted patents
- 2,883
- Published applications
- 3,713
- Assignees
- 786
- Inventors
- 4,851
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 21 | 0 |
| 1977 | 17 | 0 |
| 1978 | 9 | 0 |
| 1979 | 9 | 0 |
| 1980 | 6 | 0 |
| 1981 | 9 | 0 |
| 1982 | 9 | 0 |
| 1983 | 8 | 0 |
| 1984 | 4 | 0 |
| 1985 | 16 | 0 |
| 1986 | 12 | 0 |
| 1987 | 7 | 0 |
| 1988 | 15 | 0 |
| 1989 | 12 | 0 |
| 1990 | 14 | 0 |
| 1991 | 16 | 0 |
| 1992 | 25 | 0 |
| 1993 | 14 | 0 |
| 1994 | 17 | 0 |
| 1995 | 18 | 0 |
| 1996 | 16 | 0 |
| 1997 | 20 | 0 |
| 1998 | 34 | 0 |
| 1999 | 49 | 0 |
| 2000 | 63 | 0 |
| 2001 | 82 | 43 |
| 2002 | 117 | 138 |
| 2003 | 126 | 164 |
| 2004 | 103 | 197 |
| 2005 | 89 | 209 |
| 2006 | 103 | 195 |
| 2007 | 98 | 206 |
| 2008 | 92 | 171 |
| 2009 | 61 | 174 |
| 2010 | 77 | 128 |
| 2011 | 87 | 105 |
| 2012 | 83 | 110 |
| 2013 | 107 | 110 |
| 2014 | 103 | 101 |
| 2015 | 84 | 145 |
| 2016 | 98 | 119 |
| 2017 | 92 | 130 |
| 2018 | 100 | 111 |
| 2019 | 98 | 147 |
| 2020 | 107 | 177 |
| 2021 | 113 | 163 |
| 2022 | 97 | 150 |
| 2023 | 78 | 139 |
| 2024 | 76 | 128 |
| 2025 | 100 | 136 |
| 2026 | 72 | 117 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Main groups
Granted patents with any code in the group
Recent patents
- Functionalized carbon particle CMP slurry dispersion6 Oct 2026US 12,753,326 B2DuPont Electronic Materials Holding, Inc.
- Methods of forming an abrasive slurry and methods for chemical-mechanical polishing29 Sep 2026US 12,746,637 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Chemical mechanical planarization polishing for shallow trench isolation29 Sep 2026US 12,751,256 B2Versum Materials US, LLC
- Polishing composition for semiconductor process and method for polishing a substrate using the same22 Sep 2026US 12,742,096 B2Ycchem Co., Ltd.
- Compositions for polishing hardmasks and related systems and methods22 Sep 2026US 12,742,097 B2Entegris, Inc.
- Vinyl-based polymer, method for producing same, polishing liquid, and vinyl-based monomer8 Oct 2026US 2026/0308299 A1Toagosei Co., Ltd.
- Cmp slurry composition for polishing copper barrier layer8 Oct 2026US 2026/0308417 A1Ycchem Co., Ltd.
- Modified cerium oxide polishing solution for shallow trench isolation and preparation method thereof1 Oct 2026US 2026/0297378 A1Inner Mongolia University
- Cmp polishing liquid and polishing method1 Oct 2026US 2026/0297379 A1Resonac Corporation
- Cmp polishing liquid and polishing method1 Oct 2026US 2026/0297380 A1Resonac Corporation
Most cited
By later US patents
- Chemical mechanical polishing slurry for metal layers541US 5,527,423 ACabot Corporation · 1996
- Chemical mechanical polishing slurry useful for copper substrates281US 5,954,997 ACabot Corporation · 1999
- Slurries for chemical mechanical polishing268US 5,340,370 AIntel Corporation · 1994
- Chemical mechanical polishing (CMP) slurry for polishing copper interconnects which use tantalum-based barrier layers232US 6,001,730 AMotorola, Inc. · 1999
- Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor218US 4,954,142 AInternational Business Machines Corporation · 1990