Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor

A method of chem-mech polishing an article, the method comprising the following steps:

• obtaining an article having at least two features thereon or therein which have a different etch rate with respect to a particular etchant;
• and
• contacting said article with a polishing pad while contacting said article with a slurry containing said etchant wherein said slurry comprises abrasive particles, a transition metal chelated salt and a solvent for said salt;
• said chem-mech polishing causing said at least two features to be substantially coplanar.

A method of chem-mech polishing an electronic component substrate, the method comprising the following steps:

• obtaining a substrate having at least two features thereon or therein which have a different etch rate with respect to a particular etchant;
• and
• contacting said substrate with a polishing pad while contacting said substrate with a slurry containing said etchant and abrasive particles;
• chem-mech polishing said at least two features;
• gradually decreasing the flow of said chem-mech slurry while beginning and then increasing the flow of a mechanical slurry comprising abrasive particles but no etchant;
• wherein the combination of said chem-mech polishing and mechanical polishing causing said at least two features to be substantially coplanar.

A method of chem-mech polishing an electronic component substrate, the method comprising the following steps:

• obtaining a substrate having at least two features thereon or therein which have a different etch rate with respect to a particular etchant;
• and
• contacting said substrate with a polishing pad while contacting said substrate with a slurry containing said etchant and abrasive particles;
• chem-mech polishing said at least two features;
• then
• mechanically polishing said at least two features with a slurry comprising abrasive particles but no etchant;
• wherein the combination of said chem-mech polishing and mechanical polishing causing said at least two features to be substantially coplanar.