6,600 results
PatentTitle and first matching claimMatch
- US 2026/0317652 A1Published 15 Oct 2026
- US 2026/0317582 A1Published 15 Oct 2026
- US 12,760,202 B2Granted 13 Oct 2026Polishing composition
Shin-Etsu Chemical Co., Ltd.
- US 2026/0308417 A1Published 8 Oct 2026Cmp slurry composition for polishing copper barrier layer
Ycchem Co., Ltd.
- US 2026/0308299 A1Published 8 Oct 2026
- US 12,753,326 B2Granted 6 Oct 2026Functionalized carbon particle CMP slurry dispersion
DuPont Electronic Materials Holding, Inc.
- US 2026/0297384 A1Published 1 Oct 2026Polishing slurry, polishing system, and method for polishing semiconductor substrate
Sheng-Han Chen, Ying-Chieh Chaoinventors
- US 2026/0297383 A1Published 1 Oct 2026Polishing composition and polishing method
Fujimi Incorporated
- US 2026/0297382 A1Published 1 Oct 2026Polishing composition
Sonosuke ISHIGURO, Shintaro MAKI +1inventors
- US 2026/0297381 A1Published 1 Oct 2026Method for producing dispersion liquid containing colloidal silica particles
Fujimi Incorporated
- US 2026/0297380 A1Published 1 Oct 2026Cmp polishing liquid and polishing method
Resonac Corporation
- US 2026/0297378 A1Published 1 Oct 2026Modified cerium oxide polishing solution for shallow trench isolation and preparation method thereof
Inner Mongolia University
- US 12,751,256 B2Granted 29 Sep 2026Chemical mechanical planarization polishing for shallow trench isolation
Versum Materials US, LLC
- US 12,746,637 B2Granted 29 Sep 2026Methods of forming an abrasive slurry and methods for chemical-mechanical polishing
Taiwan Semiconductor Manufacturing Company, Ltd.
- US 2026/0286188 A1Published 24 Sep 2026Polishing composition, method for producing substrate, and polishing system
Fujimi Incorporated
- US 2026/0286187 A1Published 24 Sep 2026
- US 2026/0286186 A1Published 24 Sep 2026Polishing slurry and method of manufacturing semiconductor device
Samsung Electronics Co., Ltd.
- US 2026/0286185 A1Published 24 Sep 2026Polishing composition and polishing method
Fujimi Incorporated
- US 2026/0286184 A1Published 24 Sep 2026Polishing compositions and methods of use thereof
Fujifilm Electronic Materials U.S.A., Inc.
- US 2026/0286181 A1Published 24 Sep 2026Polishing method, abrasive, and semiconductor device
Kioxia Corporation
- US 2026/0286180 A1Published 24 Sep 2026Abrasive stick and polishing method
Taimei Chemicals Co., Ltd.
- US 12,742,098 B2Granted 22 Sep 2026