Cmp polishing liquid and polishing method
AssigneeResonac Corporation
InventorsMasahiro KANNO, Hiroshi NAKAGAWA
Life of this patent
Estimating the term…
Abstract
A CMP polishing liquid for polishing a member to be polished that contains a carbon material, wherein the content of abrasive grains is from 0 to 5 mass %, and the CMP polishing liquid contains iron ions. A polishing method including a step of polishing a member to be polished that contains a carbon material using the CMP polishing liquid. A method for manufacturing a semiconductor device, including obtaining a semiconductor device using a member to be polished that has been polished by the polishing method.
Claims19
A CMP polishing liquid for polishing a member to be polished comprising a carbon material, wherein a content of abrasive grains is from 0 to 5 mass %,
- Wherein the CMP polishing liquid comprises iron ions.
Dependencies are inferred from the claim text.