Functionalized carbon particle CMP slurry dispersion
AssigneeDuPont Electronic Materials Holding, Inc.
InventorsArthur W. Martin, Yi Guo
Life of this patent
Estimating the term…
Loading patent…
AssigneeDuPont Electronic Materials Holding, Inc.
InventorsArthur W. Martin, Yi Guo
Estimating the term…
The invention provides a chemical mechanical polishing solution for metal and metal nitride substrates. The invention includes a solvent and functionalized carbon-based particles having oxygen-containing functional groups. The functionalized carbon-based particles have oxygen-containing functional groups that react with a peroxy moiety to increase oxygen to carbon atomic ratio on the functionalized carbon-based particles. The functionalized carbon-based particles contain at least 10 weight percent of an sp3-containing structure, the functionalized carbon-based particles include at least 0.01 atomic percent oxygen and a surface of the functionalized carbon-based particles has an atomic oxygen to carbon ratio of at least 0.01. The solution also includes an oligomer or polymer having at least 50 mol % R1-C(O)—N[—R2, —R3] units wherein R1, R2, —R3 are selected from at least one of H, saturated or unsaturated aromatic or aliphatic groups, aryl, cycloaliphatic hydrocarbon or a mixture thereof.
A chemical mechanical polishing solution for metal and metal nitride substrates comprising:
Dependencies are inferred from the claim text.