Water-based, high-efficiency chemical reagent for substrate surface particle removal
AssigneeApplied Materials, Inc.
InventorsHong Yan, Raymond Hoiman Hung, Ying Wang, Xundong Dai
Life of this patent
Estimating the term…
Abstract
Embodiments of the disclosure provided herein include systems and methods for cleaning semiconductor substrates The method includes rotating a substrate disposed on a substrate support, spraying a front side of the substrate using a cleaning agent including one or more chelating agents through a front side nozzle assembly disposed above the substrate support, and spraying a back side of the substrate using the cleaning agent through a back side dispenser assembly disposed below the substrate support.
Claims27
A method of cleaning a substrate, comprising:
- rotating a substrate disposed on a substrate support, wherein the substrate is supported on a back surface of the substrate;
- supplying a front surface of the substrate with a cleaning agent through a front side nozzle assembly, the front surface disposed opposite the back surface, wherein the cleaning agent comprises one or more chelating agents;
- and
- supplying the back surface of the substrate with the cleaning agent from a back side dispenser assembly while the back surface of the substrate is supported on the substrate support.
A method of cleaning a substrate, comprising:
- rotating a substrate disposed on a substrate support, wherein the substrate support supports the substrate from a back surface of the substrate;
- supplying a front surface of the substrate with a cleaning agent comprising one or more chelating agents through a front side nozzle assembly disposed above the substrate support, the front surface disposed opposite the back surface;
- and
- supplying the back surface of the substrate with the cleaning agent through a back side dispenser assembly disposed below the substrate support while the back surface of the substate is supported on the substrate support.
A method of cleaning a substrate, comprising:
- rotating a substrate disposed on a substrate support, wherein the substrate is supported on a back surface of the substrate by the substrate support;
- supplying a front surface of the substrate with a cleaning agent from a front side nozzle assembly, the cleaning agent being water based and comprising:
- water;
- an organic solvent;
- a surfactant of about 0.001% to about 1% by mass of the cleaning agent;
- a chelating agent;
- and
- an organic alkaline;
- supplying the back surface of the substrate with the cleaning agent from a back side dispenser assembly while the back surface of the substrate is supported on the substrate support;
- activating the chelating agent with the water;
- and
- removing metals from the substrate with the surfactant and bonding the chelating agent to the metals, wherein the metals comprise one or more of metal ions and metal particles.
Dependencies are inferred from the claim text.