Post chemical mechanical planarization (CMP) cleaning
AssigneeVersum Materials US, LLC
InventorDnyanesh C. Tamboli
Life of this patent
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Abstract
Provided are formulations that offer a high cleaning effect on inorganic particles, organic residues, chemical residues, reaction products on the surface due to interaction of the wafer surface with the Chemical Mechanical Planarization (CMP) slurry and elevated levels of undesirable metals on the surface left on the semiconductor devices after the CMP. The post-CMP cleaning formulations comprise one or more organic acid, one or more polymer and a fluoride compound with pH <7 and optionally a surfactant with two sulfonic acid groups.
Claims10
A post Chemical Mechanical Planarization (CMP) cleaning composition consisting of:
- at least one organic acid or salts thereof selected from the group consisting of dicarboxylic acid, hydroxycarboxylic acid, salts thereof, and combinations thereof;
- a fluoride compound selected from the group consisting of ammonium fluoride, ammonium bifluoride, quaternary ammonium fluoride and combinations thereof;
- at least one polymeric additive selected from the group consisting of acrylic acid-acrylamido propane sulfonic acid copolymer and salts thereof;
- poly(acrylic acid) and salts thereof;
- poly(2-acrylamido-2-methyl-1-propanesulfonic acid) and salts thereof;
- carboxymethyl cellulose;
- methyl cellulose;
- hydroxypropyl methyl cellulose;
- poly-(1-vinylpyrrolidone-co-2-dimethylaminoethyl methacrylate);
- poly(sodium 4-styrenesulfonate);
- polyethylene glycol, poly(4-styrenesulfonic acid) and salts thereof;
- polypropylene glycol;
- polyacrylamide;
- poly(acrylamide/acrylic acid) copolymer and salts thereof;
- and combinations thereof;
- and
- water;
- optionally
- a surfactant having two or more sulfonic acid groups;
- biological preservative selected from the group consisting of methylisothiazolinone, methylchloroisothiazolinone, benzisothiazolinone, and combinations thereof;
- and
- pH adjusting agent;
- wherein the composition has a pH of between 1 to 7.
Dependencies are inferred from the claim text.