Wafer cleaning method and apparatus

Abstract

A wafer cleaning method and apparatus clean a surface of a polished wafer. The wafer cleaning method includes: S101, wetting the surface of the wafer with DIW; S102, spraying the surface of the wafer with SC1 having a first preset temperature; S103, continuing to spray the surface of the wafer with SC1 having the first preset temperature, and controlling a brush simultaneously to scrub the surface of the wafer; S104, performing a spray cleaning on the surface of the scrubbed wafer with DIW having a second preset temperature for a first preset time; S105, repeating the steps S103 to S104 until a first preset number of times; S106, cleaning the surface of the wafer alternately with DHF and DIO3 after executing the step S105. Through the above method, the transition step of the DIW spray cleaning at the second preset temperature can be added in multiple and continuous scrubbings.

Dependencies are inferred from the claim text.