Integrated processing of porous dielectric, polymer-coated substrates and epoxy within a multi-chamber vacuum system confirmation

A method for degassing a substrate, sequentially comprising:

• positioning a substrate comprising a polymer or an epoxy within a processing chamber;
• directing a variable frequency microwave radiation source to deliver microwave radiation to the substrate;
• delivering microwave radiation to the substrate at a frequency which changes over short bursts of time while maintaining the temperature of the substrate at a degas temperature;
• and
• removing a first set of oxygen containing compounds from the chamber.

A vacuum multi-chamber deposition tool comprising:

• a load lock chamber;
• a first transfer chamber with a first central robot mounted therein;
• a second transfer chamber with a second central robot mounted therein;
• a degas chamber comprising:
• a chamber body;
• a substrate support configured to support a substrate having a selected diameter;
• a substrate heating mechanism configured to heat the substrate;
• a temperature measuring device;
• and
• a variable frequency microwave radiation source using two or more frequencies selected from the range of 5.85 GHz to 7.0 GHz which vary by between 200 Hz and 280 Hz and configured to deliver the microwave radiation of varying frequency toward the surface of the substrate support;
• a pre-metallization clean chamber fluidly connected with the degas chamber and employing a sputtering clean process comprising an inert gas;
• and
• a deposition chamber fluidly connected with the pre-metallization clean chamber.