H10P 70/60
Cleaning only by mechanical processes
Official title: {Cleaning only by mechanical processes}
H10P70/60 (Cleaning only by mechanical processes) appears on 100 US grants and 127 published applications in this corpus.
Search patents in H10P- Granted patents
- 100
- Published applications
- 127
- Assignees
- 52
- Inventors
- 266
- Latest grant
- 28 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 1 | 0 |
| 2004 | 0 | 1 |
| 2005 | 0 | 1 |
| 2006 | 0 | 4 |
| 2007 | 2 | 6 |
| 2008 | 1 | 4 |
| 2009 | 0 | 5 |
| 2010 | 5 | 5 |
| 2011 | 3 | 4 |
| 2012 | 4 | 2 |
| 2013 | 10 | 7 |
| 2014 | 3 | 6 |
| 2015 | 4 | 4 |
| 2016 | 4 | 4 |
| 2017 | 7 | 13 |
| 2018 | 4 | 9 |
| 2019 | 7 | 5 |
| 2020 | 8 | 12 |
| 2021 | 7 | 6 |
| 2022 | 7 | 9 |
| 2023 | 7 | 4 |
| 2024 | 5 | 7 |
| 2025 | 5 | 7 |
| 2026 | 3 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor fabricating system having hybrid brush assembly28 Jul 2026US 12,696,706 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Methods of separating semiconductor dies14 Jul 2026US 12,685,060 B2Texas Instruments Incorporated
- Substrate processing system and substrate processing method21 Apr 2026US 12,610,770 B2SCREEN Holdings Co., Ltd.
- Mirror device manufacturing method and mirror unit manufacturing method30 Dec 2025US 12,509,347 B2Hamamatsu Photonics K.K.
- Substrate treating method and substrate treating apparatus16 Sep 2025US 12,417,930 B2SCREEN Holdings Co., Ltd.
- Methods of separating semiconductor dies8 Oct 2026US 2026/0314289 A1
- Substrate cleaning device, substrate processing apparatus, method, and storage medium2 Jul 2026US 2026/0183804 A1Ebara Corporation
- Sheet fixing apparatus and method of manufacturing combination of workpiece and sheet fixed thereto23 Oct 2025US 2025/0327757 A1Disco Corporation
- Wafer cleaning device, wafer polishing equipment and method for cleaning wafer9 Oct 2025US 2025/0312828 A1Samsung Electronics Co., Ltd.
- Protective layer forming method and workpiece processing method9 Oct 2025US 2025/0316472 A1Disco Corporation
Most cited
By later US patents
- Edge bead removal for spin-on materials containing low volatility solvents fusing carbon dioxide cleaning24US 6,565,920 B1Honeywell International Inc. · 2003
- Cleaning device and roll cleaning member15US 10,453,708 B2Ebara Corporation · 2019
- Method for treating a wafer edge14US 7,256,148 B2International Business Machines Corporation · 2007
- Method for scrubbing substrate12US 5,795,401 AM. Setek Co., Ltd. · 1998
- Wafer bonded virtual substrate and method for forming the same12US 7,238,622 B2California Institute of Technology · 2007