Methods of patterning substrates

Abstract

Described herein are methods of patterning substrates. For example, disclosed herein are methods comprising: irradiating a portion of a top surface of a substrate with a laser, wherein the laser has a fluence of 0.05-2.5 J/cm2 and a wavelength of 190-2500 nm, and the irradiation comprises a laser pulse having a duration of from 200 femtoseconds to 10 nanoseconds. In some examples, the portion irradiated with the laser defines a growth surface and the remaining portion comprises a non-growth surface, or the portion irradiated with the laser defines a non-growth surface and the remaining portion comprises a growth surface; and the method further comprises subsequently depositing a first material on the substrate, wherein the first material selectively deposits on the growth surface relative to the non-growth surface; thereby forming a patterned substrate. Also disclosed herein are patterned substrates made by any of the methods disclosed herein.

Dependencies are inferred from the claim text.