H10P 74/00
Testing or measuring during manufacture or treatment of wafers, substrates or devices
H10P74/00 (Testing or measuring during manufacture or treatment of wafers, substrates or devices) appears on 15,536 US grants and 16,756 published applications in this corpus.
Search patents in H10P- Granted patents
- 15,536
- Published applications
- 16,756
- Assignees
- 2,378
- Inventors
- 28,858
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 4 | 0 |
| 1978 | 8 | 0 |
| 1979 | 3 | 0 |
| 1980 | 7 | 0 |
| 1981 | 8 | 0 |
| 1982 | 5 | 0 |
| 1983 | 5 | 0 |
| 1984 | 14 | 0 |
| 1985 | 6 | 0 |
| 1986 | 7 | 0 |
| 1987 | 12 | 0 |
| 1988 | 12 | 0 |
| 1989 | 24 | 0 |
| 1990 | 20 | 0 |
| 1991 | 27 | 0 |
| 1992 | 30 | 0 |
| 1993 | 51 | 0 |
| 1994 | 59 | 0 |
| 1995 | 95 | 0 |
| 1996 | 96 | 0 |
| 1997 | 154 | 0 |
| 1998 | 197 | 0 |
| 1999 | 257 | 0 |
| 2000 | 273 | 0 |
| 2001 | 344 | 148 |
| 2002 | 405 | 361 |
| 2003 | 421 | 371 |
| 2004 | 432 | 380 |
| 2005 | 355 | 426 |
| 2006 | 348 | 420 |
| 2007 | 292 | 396 |
| 2008 | 292 | 491 |
| 2009 | 251 | 443 |
| 2010 | 408 | 422 |
| 2011 | 356 | 449 |
| 2012 | 379 | 509 |
| 2013 | 433 | 629 |
| 2014 | 583 | 777 |
| 2015 | 671 | 896 |
| 2016 | 741 | 809 |
| 2017 | 918 | 885 |
| 2018 | 812 | 888 |
| 2019 | 849 | 903 |
| 2020 | 915 | 939 |
| 2021 | 746 | 840 |
| 2022 | 639 | 969 |
| 2023 | 683 | 938 |
| 2024 | 768 | 946 |
| 2025 | 660 | 875 |
| 2026 | 459 | 646 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Optical thickness control during a chemical mechanical polishing process and apparatus for effecting the same6 Oct 2026US 12,752,390 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method of manufacturing a redistribution layer, redistribution layer, integrated circuit and methods for electrically testing and protecting the integrated circuit6 Oct 2026US 12,753,493 B2STMicroelectronics S,r.l.
- Semiconductor test apparatus6 Oct 2026US 12,754,228 B2Samsung Electronics Co., Ltd.
- Device inspection apparatus and device inspection method6 Oct 2026US 12,754,233 B2Mitsubishi Electric Corporation
- Heating/cooling device and heating/cooling method6 Oct 2026US 12,757,671 B2Tokyo Electron Limited
- Surface inspection tool for transfer tools and methods of using the same8 Oct 2026US 2026/0309645 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Display apparatus, apparatus for attaching cover panel, and method of attaching cover panel8 Oct 2026US 2026/0314247 A1Samsung Display Co., Ltd.
- Method for fabricating a semiconductor device using heat treatment apparatus8 Oct 2026US 2026/0314299 A1Samsung Electronics Co., Ltd.
- Wafer release mechanism8 Oct 2026US 2026/0314329 A1Taiwan Semiconductor Manufacturing Company.Ltd
- System and method for detecting semiconductor processing error8 Oct 2026US 2026/0314334 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Stacked semiconductor devices and methods of forming same1,870US 9,496,189 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Semiconductor chip assemblies with fan-in leads734US 5,148,265 AIST Associates, Inc. · 1992
- Semiconductor chip assemblies having interposer and flexible lead719US 5,148,266 AIST Associates, Inc. · 1992