H10P 74/23
Testing or measuring during manufacture or treatment of wafers, substrates or devices
Official title: {characterised by multiple measurements, corrections, marking or sorting processes}
H10P74/23 (Testing or measuring during manufacture or treatment of wafers, substrates or devices) appears on 6,754 US grants and 6,959 published applications in this corpus.
Search patents in H10P- Granted patents
- 6,754
- Published applications
- 6,959
- Assignees
- 1,300
- Inventors
- 13,582
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 3 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 4 | 0 |
| 1982 | 3 | 0 |
| 1983 | 0 | 0 |
| 1984 | 5 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 3 | 0 |
| 1989 | 9 | 0 |
| 1990 | 10 | 0 |
| 1991 | 9 | 0 |
| 1992 | 10 | 0 |
| 1993 | 26 | 0 |
| 1994 | 28 | 0 |
| 1995 | 50 | 0 |
| 1996 | 50 | 0 |
| 1997 | 75 | 0 |
| 1998 | 107 | 0 |
| 1999 | 136 | 0 |
| 2000 | 130 | 0 |
| 2001 | 180 | 71 |
| 2002 | 206 | 178 |
| 2003 | 212 | 184 |
| 2004 | 223 | 184 |
| 2005 | 164 | 204 |
| 2006 | 150 | 172 |
| 2007 | 133 | 163 |
| 2008 | 133 | 185 |
| 2009 | 96 | 162 |
| 2010 | 147 | 156 |
| 2011 | 138 | 173 |
| 2012 | 158 | 202 |
| 2013 | 154 | 228 |
| 2014 | 224 | 287 |
| 2015 | 253 | 363 |
| 2016 | 278 | 338 |
| 2017 | 401 | 409 |
| 2018 | 372 | 451 |
| 2019 | 410 | 424 |
| 2020 | 443 | 435 |
| 2021 | 321 | 359 |
| 2022 | 290 | 394 |
| 2023 | 271 | 337 |
| 2024 | 308 | 350 |
| 2025 | 253 | 274 |
| 2026 | 169 | 276 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Optical thickness control during a chemical mechanical polishing process and apparatus for effecting the same6 Oct 2026US 12,752,390 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Heating/cooling device and heating/cooling method6 Oct 2026US 12,757,671 B2Tokyo Electron Limited
- Repair of solder bumps29 Sep 2026US 12,746,613 B2Orbotech Ltd.
- Semiconductor processing equipment and impedance-matching method29 Sep 2026US 12,749,654 B2Beijing Naura Microelectronics Equipment Co., Ltd.
- Cylindric decomposition for efficient mitigation of substrate deformation with film deposition and ion implantation29 Sep 2026US 12,751,253 B2APPLIED Materials.Inc.
- Surface inspection tool for transfer tools and methods of using the same8 Oct 2026US 2026/0309645 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Display apparatus, apparatus for attaching cover panel, and method of attaching cover panel8 Oct 2026US 2026/0314247 A1Samsung Display Co., Ltd.
- Method for fabricating a semiconductor device using heat treatment apparatus8 Oct 2026US 2026/0314299 A1Samsung Electronics Co., Ltd.
- Improved Run-to-Run Control in Semiconductor Manufacturing8 Oct 2026US 2026/0314336 A1Robert Bosch GmbH
- Polishing method and polishing apparatus1 Oct 2026US 2026/0305264 A1Ebara Corporation
Most cited
By later US patents
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Stacked semiconductor devices and methods of forming same1,870US 9,496,189 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Plasma monitoring and control method and system625US 5,576,629 AFourth State Technology, Inc. · 1996
- Semiconductor device dielectric interface layer544US 8,728,832 B2ASM IP Holdings B.V. · 2014
- Semiconductor device dielectric interface layer508US 9,177,784 B2ASM IP Holdings B.V. · 2015