Semiconductor processing equipment and impedance-matching method

Semiconductor processing equipment comprising a radio frequency (RF) power source, an impedance matching device, and a processing chamber, wherein:

• the RF power source is configured to apply RF power to the processing chamber of the semiconductor processing equipment through the impedance matching device;
• and
• the impedance-matching device includes:
• a parameter adjustable device;
• and
• a controller configured to, in a processing preparation step, obtain currently stored impedance-matching data corresponding to a processing ignition step, the impedance-matching data including a parameter adjustment position corresponding to the parameter adjustable device in the impedance-matching device of the semiconductor processing equipment, adjust a parameter value of the parameter adjustable device based on the parameter adjustment position, wherein for semiconductor processing that is performed multiple times, the currently stored impedance-matching data is a value that is updated multiple times, and in a processing ignition step, when applying the RF power to the processing chamber of the semiconductor processing equipment through the impedance-matching device, adjust the parameter-adjustable device to achieve impedance matching, determine a current parameter-adjustment position of the parameter adjustable device when impedance is matched, and update the impedance-matching data based on the current parameter adjustment position,
• wherein the processing preparation step is performed prior to applying the RF power to the processing chamber, zero RF power is applied to the processing chamber during the processing preparation step, and the impedance-matching data updated during the processing ignition step is persistently stored for retrieval in a subsequent processing preparation step prior to applying the RF power to the processing chamber again.