H10P 74/235
Comprising optical enhancement of defects or not-directly-visible states
Official title: {comprising optical enhancement of defects or not-directly-visible states}
H10P74/235 (Comprising optical enhancement of defects or not-directly-visible states) appears on 283 US grants and 281 published applications in this corpus.
Search patents in H10P- Granted patents
- 283
- Published applications
- 281
- Assignees
- 166
- Inventors
- 797
- Latest grant
- 30 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 4 | 0 |
| 1999 | 10 | 0 |
| 2000 | 7 | 0 |
| 2001 | 9 | 3 |
| 2002 | 12 | 3 |
| 2003 | 12 | 3 |
| 2004 | 6 | 8 |
| 2005 | 8 | 14 |
| 2006 | 9 | 11 |
| 2007 | 6 | 9 |
| 2008 | 10 | 15 |
| 2009 | 4 | 5 |
| 2010 | 7 | 3 |
| 2011 | 7 | 8 |
| 2012 | 8 | 4 |
| 2013 | 0 | 4 |
| 2014 | 5 | 13 |
| 2015 | 7 | 9 |
| 2016 | 15 | 11 |
| 2017 | 9 | 11 |
| 2018 | 10 | 23 |
| 2019 | 19 | 24 |
| 2020 | 25 | 25 |
| 2021 | 12 | 11 |
| 2022 | 12 | 13 |
| 2023 | 12 | 12 |
| 2024 | 14 | 19 |
| 2025 | 9 | 12 |
| 2026 | 8 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method and system of producing microstructured components30 Jun 2026US 12,667,917 B23D-Micromac AG
- Apparatus and methods for three dimensional reticle defect smart repair23 Jun 2026US 12,666,928 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Inspection device and inspection method16 Jun 2026US 12,660,555 B2Hamamatsu Photonics K.K.
- Method for fabricating a semiconductor device28 Apr 2026US 12,616,003 B2Iucf-Hyu (Industry-University Cooperation
- Defect inspection apparatus and defect inspection method17 Mar 2026US 12,578,281 B2Lasertec Corporation
- Solder reflow with optical endpoint control24 Sep 2026US 2026/0293585 A1Yield Engineering Systems, Inc.
- Inspection device and inspection method24 Sep 2026US 2026/0293586 A1Hamamatsu Photonics K.K.
- Apparatus and method for fabricating display device, and display device10 Sep 2026US 2026/0271516 A1Samsung Display Co., Ltd.
- Method for monitoring word line16 Jul 2026US 2026/0206542 A1Winbond Electronics Corp.
- Defect inspection apparatus and defect inspection method2 Jul 2026US 2026/0185945 A1Lasertec Corporation
Most cited
By later US patents
- Method of measuring thickness of epitaxial layer94US 6,521,470 B1United Microelectronics Corp. · 2003
- Method for in-line monitoring of via/contact holes etch process based on test structures in semiconductor wafer manufacturing90US 6,815,345 B2Hermes-Microvision (Taiwan) Inc. · 2004
- Structure and method for determining a defect in integrated circuit manufacturing process87US 8,089,297 B2Hermes Microvision, Inc. · 2012
- Method for in-line monitoring of via/contact holes etch process based on test structures in semiconductor wafer manufacturing82US 7,105,436 B2Hermes Microvision, Inc. · 2006
- Optical tuning of light emitting semiconductor junctions44US 9,412,911 B2The Silanna Group Pty Ltd · 2016