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US 8,089,297 B2Granted
Structure and method for determining a defect in integrated circuit manufacturing process
AssigneeHermes Microvision, Inc.
InventorsHong Xiao, Jack Jau, Chang Chun Yeh
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Abstract
The present invention discloses a structure and method for determining a defect in integrated circuit manufacturing process, wherein the structure comprises a plurality of normal active areas formed in a plurality of first arrays and a plurality of defective active areas formed in a plurality of second arrays. The first arrays and second arrays are interlaced, and the defect is determined by monitoring a voltage contrast from a charged particle microscope image of the active areas.
Claims9
A test structure for determining a defect in integrated circuit manufacturing process, comprising:
- a plurality of normal active areas formed in a plurality of first arrays on a die;
- and
- a plurality of defective active areas formed in a plurality of second arrays on the die, wherein said first arrays and said second arrays are interlaced,
- wherein said defect is determined by monitoring a voltage contrast from a charged particle microscope image of said active areas.
1 more element
Dependencies are inferred from the claim text.