Method and system of producing microstructured components

A system that produces a microstructured component comprising a multiplicity of micro-functional elements on a substrate that carries an array of pixel-forming micro-light-emitting diodes on an electrical supply structure, comprising:

• a control unit;
• a laser processing station with a laser processing unit controllable by the control unit;
• wherein the laser processing station is configured to perform at least one of a Laser Lift-Off (LLO) operation selectively removing one material from another material and a Laser-Induced Forward Transfer (LIFT) operation configured to transfer material onto the substrate by directing laser radiation with positional accuracy on the material;
• the laser processing unit comprising a mask having a multiplicity of mask openings, the mask being arranged in a mask plane and configured to split a laser beam into a multiplicity of partial beams, the mask openings emitting laser radiation being imageable onto a processing plane of the laser processing unit, so that the laser processing unit is configured for parallel processing at a multiplicity of processing locations, the laser processing comprising:
• a workpiece movement system that positions a workpiece to be processed in a processing position of the laser processing station in reaction to movement signals of the control unit;
• a camera system with a camera that observes the workpiece, the camera system designed to capture at least one portion of the workpiece lying in the object field of the camera and generate an image representing the portion;
• and
• an evaluation unit that evaluate the image by image processing for the purpose of ascertaining position data representing the actual position of at least one structural element of the workpiece in the object field, and comparing the actual position with a target position of the structural element and generating correction signals depending on a deviation of the actual position from the target position,
• the control unit configured to correct the processing position by controlling the workpiece movement system to match the actual position to the target position on the basis of the correction signals,
• and cause the laser processing unit to radiate in at least one laser beam directed at the workpiece to locally laser process the workpiece at at least one processing location of the workpiece.