Inspection device and inspection method

An inspection device comprising:

• an irradiation unit configured to irradiate a wafer having a first surface and a second surface with a laser beam from a first surface side of the wafer;
• an imaging unit configured to output light having a property of transmitting through the wafer, and detect the light that has propagated through the wafer;
• and
• a control unit,
• wherein the control unit is configured to execute a first process of controlling the irradiation unit according to a processing condition set such that one or a plurality of modified regions are formed inside the wafer by irradiating the wafer with the laser beam and a full-cut state where cracks extending from the modified regions have reached the first surface and the second surface is attained;
• a second process of identifying a state of the crack on the first surface extending from the modified region, and a state of at least one of the modified regions and the cracks inside the wafer, based on a signal output from the imaging unit that has detected the light;
• and a third process of determining whether or not a dicing force applied to the wafer according to the processing condition is proper, based on information identified in the second process, and
• wherein the control unit identifies a clearness of a mark of the laser beam related to the modified region in the second process, and determines that the dicing force has not reached a proper range and is not proper, when the identified clearness of the mark is higher than a predetermined value, in the third process.

An inspection device comprising:

• an irradiation unit configured to irradiate a wafer having a first surface and a second surface with a laser beam from a first surface side of the wafer;
• an imaging unit configured to output light having a property of transmitting through the wafer, and detect the light that has propagated through the wafer;
• and
• a control unit,
• wherein the control unit is configured to execute a first process of controlling the irradiation unit according to a processing condition set such that one or a plurality of modified regions are formed inside the wafer by irradiating the wafer with the laser beam and a full-cut state where cracks extending from the modified regions have reached the first surface and the second surface is attained;
• a second process of identifying a state of the crack on the first surface extending from the modified region, and a state of at least one of the modified regions and the cracks inside the wafer, based on a signal output from the imaging unit that has detected the light;
• and a third process of determining whether or not a dicing force applied to the wafer according to the processing condition is proper, based on information identified in the second process, and
• wherein the control unit identifies a meandering width of the crack on the first surface in a direction intersecting a thickness direction of the wafer in the second process, and determines that the dicing force is out of a proper range and is not proper, when the identified meandering width of the crack is larger than a predetermined value, in the third process.

An inspection device comprising:

• an irradiation unit configured to irradiate a wafer having a first surface and a second surface with a laser beam from a first surface side of the wafer;
• an imaging unit configured to output light having a property of transmitting through the wafer, and detect the light that has propagated through the wafer;
• and
• a control unit,
• wherein the control unit is configured to execute a first process of controlling the irradiation unit according to a processing condition set such that a plurality of modified regions are formed inside the wafer by irradiating the wafer with the laser beam and a full-cut state where cracks extending from the modified regions have reached the first surface and the second surface is attained;
• a pre-identification process of identifying information related to the modified regions and to the cracks extending from the modified regions, based on a signal output from the imaging unit that has detected the light, before the modified region to be formed last in the first process is formed;
• and a pre-determination process of determining whether or not a state before the modified region to be formed last is formed is proper, based on the information identified in the pre-identification process.