H10P 74/232
Comprising connection or disconnection of parts of a device in response to
Official title: {comprising connection or disconnection of parts of a device in response to a measurement}
H10P74/232 (Comprising connection or disconnection of parts of a device in response to) appears on 665 US grants and 708 published applications in this corpus.
Search patents in H10P- Granted patents
- 665
- Published applications
- 708
- Assignees
- 262
- Inventors
- 1,235
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 3 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 4 | 0 |
| 1990 | 4 | 0 |
| 1991 | 4 | 0 |
| 1992 | 1 | 0 |
| 1993 | 5 | 0 |
| 1994 | 5 | 0 |
| 1995 | 8 | 0 |
| 1996 | 8 | 0 |
| 1997 | 14 | 0 |
| 1998 | 19 | 0 |
| 1999 | 13 | 0 |
| 2000 | 11 | 0 |
| 2001 | 15 | 9 |
| 2002 | 14 | 12 |
| 2003 | 18 | 17 |
| 2004 | 18 | 20 |
| 2005 | 17 | 29 |
| 2006 | 16 | 16 |
| 2007 | 16 | 13 |
| 2008 | 11 | 13 |
| 2009 | 8 | 8 |
| 2010 | 8 | 13 |
| 2011 | 9 | 19 |
| 2012 | 19 | 25 |
| 2013 | 20 | 25 |
| 2014 | 37 | 20 |
| 2015 | 22 | 26 |
| 2016 | 22 | 27 |
| 2017 | 32 | 29 |
| 2018 | 29 | 35 |
| 2019 | 34 | 40 |
| 2020 | 40 | 45 |
| 2021 | 29 | 41 |
| 2022 | 32 | 35 |
| 2023 | 21 | 28 |
| 2024 | 30 | 32 |
| 2025 | 27 | 26 |
| 2026 | 13 | 105 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Structure for monitoring hybrid bonds in a semiconductor chip package7 Jul 2026US 12,677,640 B2International Business Machines Corporation
- Method for producing a light emitting diode supply substrate, method for producing a light emitting diode display, method for producing a division unit for a light emitting diode display, and method for producing a device supply substrate9 Jun 2026US 12,653,068 B2Shin-Etsu Chemical Co., Ltd.
- Method and apparatus for hybrid bonding17 Sep 2026US 2026/0282846 A1Tokyo Electron Limited
- Simultaneous Silicon Spring and Chip Singulation DRIE13 Aug 2026US 2026/0239987 A1
- High Current Column Grid Array Pillars13 Aug 2026US 2026/0240010 A1
- Electronic device and manufacturing method thereof23 Jul 2026US 2026/0215337 A1Innolux Corporation
- Targeted Jet-Cooling System for Zetta-Scale Computing Assemblies16 Jul 2026US 2026/0202891 A1
Most cited
By later US patents
- Making and testing an integrated circuit using high density probe points307US 5,103,557 A1992
- Semiconductor stack structures and fabrication/sparing methods utilizing programmable spare circuit261US 5,502,333 AInternational Business Machines Corporation · 1996
- Method of making a flexible tester surface for testing integrated circuits253US 5,020,219 A1991
- Semiconductor chip repair by stacking of a base semiconductor chip and a repair semiconductor chip182US 8,679,861 B2International Business Machines Corporation · 2014
- Device mounting substrate and method of repairing defective device168US 7,148,127 B2Sony Corporation · 2006