Method of manufacturing light emitting device

A method of manufacturing a light emitting device comprising:

• providing a structure body, the structure body including a substrate and a plurality of semiconductor parts arranged on the substrate, wherein the semiconductor parts individually includes:
• a first semiconductor layer of a first conductivity type,
• a second semiconductor layer of a second conductivity type,
• a first electrode electrically connected to the first semiconductor layer,
• a second electrode electrically connected to the second semiconductor layer,
• a first terminal electrically connected to the first semiconductor layer via the first electrode, and
• a second terminal electrically connected to the second semiconductor layer via the second electrode;
• disposing an insulating member that covers the semiconductor parts while exposing the first terminals and the second terminals, wherein upper faces of the first terminals and upper faces of the second terminals are exposed from the insulating member by polishing after embedding the first terminals and the second terminals in the insulating member;
• forming wirings at locations above the semiconductor parts, wherein forming the wirings comprises:
• forming a resist on the insulating member located between the first terminal and the second terminal of each semiconductor part,
• forming a seed layer to continuously cover the first terminals, the second terminals, and the resist of the semiconductor parts arranged in a direction of arrangement,
• forming a conducting layer on the seed layer, and
• removing portions of the seed layer and the conducting layer that cover the resist such that the resist is exposed from the seed layer and the conducting layer,
• wherein,
• the wirings each is connected to the first terminal and the second terminal of two adjacent semiconductor parts in the direction of arrangement,
• the semiconductor parts connected by the wirings are serially connected,
• the semiconductor parts adjacent in a direction perpendicular to the direction of arrangement are not electrically connected by the wirings, and
• in a top view, an area of each of the wirings is larger than an area of the first terminal to which it is connected and is larger than an area of the second terminal to which it is connected;
• evaluating electrical properties of a plurality of the semiconductor parts connected by the wirings at once by bringing a testing device into contact with the wirings;
• and
• removing the insulating member and the wirings by polishing an upper face side of the structure body.