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US 2026/0240010 A1Published application
High Current Column Grid Array Pillars
OwnerKia Silverbrookinventor
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OwnerKia Silverbrookinventor
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A column grid array for low-voltage, high-current delivery uses pillars formed from bundles of parallel conductive filaments consolidated into metallic plugs at each end with an unconstrained compliant span between the plugs. The pillars are joined in a two-dimensional grid between opposing substrates to deliver aggregate current with controlled impedance while accommodating differential displacement without plastic deformation. Interleaving power and return pillars reduces loop inductance and transient droop. Optional sleeves or elastomer collars manage lateral stability; spare pillars and test features enable in-situ continuity verification and activation of redundancy. Methods include preparing filament bundles, consolidating ends by metallurgical bonding, joining plugs to substrate pads, and arranging pillars at grid pitch suitable for wafer-scale or module-scale power distribution.
A column grid array assembly comprising a first substrate, a second substrate, and a plurality of current-carrying pillars arranged in a two-dimensional grid between the substrates, each pillar comprising a bundle of electrically conductive filaments consolidated at a first end into a first metallic plug and at a second end into a second metallic plug, the filaments extending between the plugs in an unconstrained span to provide mechanical compliance while conducting power, wherein the first metallic plug is metallurgically joined to a first pad of the first substrate and the second metallic plug is metallurgically joined to a second pad of the second substrate to deliver low-voltage, high-current power between the substrates.
A power delivery apparatus comprising a power source layer, a compute substrate, and an intermediate redistribution structure, the apparatus including a column grid array of pillars mechanically and electrically coupling the power source layer to the compute substrate through the redistribution structure, each pillar comprising a multi-filament bundle consolidated into end plugs and joined to mating pads on adjacent layers, the apparatus further comprising a pattern of interleaved power and return pillars within the grid to control impedance and transient droop during pulsed loads.
A method of forming a column grid array between a first substrate and a second substrate comprising cutting multiple lengths of conductive wire to form a bundle for each pillar, consolidating a first end of each bundle into a first metallic plug and consolidating a second end of each bundle into a second metallic plug while maintaining an unconstrained span between the plugs, metallurgically joining the first metallic plug to a pad on the first substrate and metallurgically joining the second metallic plug to a pad on the second substrate, and arranging multiple pillars in a two-dimensional grid to deliver power between the substrates.
Dependencies are inferred from the claim text.