Targeted Jet-Cooling System for Zetta-Scale Computing Assemblies
OwnerKia Silverbrookinventor
Life of this patent
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Abstract
A targeted jet-cooling system removes heat from high-density compute assemblies using multiple coolant jets directed at individual heat sources. Each jet is independently tuned in flow rate, pressure, or angle to equalize flow rate and maximize thermal performance. The coolant may be a dielectric two-phase liquid at atmospheric pressure (JETSTREAM) or supercritical CO2 in a closed-loop high-pressure configuration (JETSCI). Jet arrays impinge on exposed surfaces of compute stacks mounted on a wafer- or panel-scale substrate, achieving thermal transport exceeding 100 KW per rack while sustaining computing throughput from 10 exaFLOPS to 1 zettaFLOPS per rack.
Claims20
A cooling system for an electronic computing assembly comprising a plurality of coolant jets directed toward respective heat-generating regions of the assembly, each jet being tuned in flow rate, angle, or composition to maintain substantially uniform flow rate across the assembly during operation.
A rack-scale computing module comprising a plurality of compute stacks mounted on a monolithic substrate, each compute stack having an exposed back surface, and a jet-cooling assembly configured to project coolant jets toward the exposed surfaces to remove heat generated by the compute stacks.
A method of cooling an electronic computing assembly comprising directing multiple coolant jets toward localized heat-generating regions, tuning each jet in flow rate or pressure to equalize temperature across the assembly, and collecting the coolant for recirculation.
Dependencies are inferred from the claim text.