H10P 74/20
Testing or measuring during manufacture or treatment of wafers, substrates or devices
Official title: characterised by the properties tested or measured, e.g. structural or electrical properties
H10P74/20 (Testing or measuring during manufacture or treatment of wafers, substrates or devices) appears on 8,191 US grants and 9,710 published applications in this corpus.
Search patents in H10P- Granted patents
- 8,191
- Published applications
- 9,710
- Assignees
- 1,568
- Inventors
- 17,604
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 3 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 3 | 0 |
| 1982 | 1 | 0 |
| 1983 | 3 | 0 |
| 1984 | 3 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 8 | 0 |
| 1988 | 5 | 0 |
| 1989 | 5 | 0 |
| 1990 | 0 | 0 |
| 1991 | 4 | 0 |
| 1992 | 9 | 0 |
| 1993 | 15 | 0 |
| 1994 | 21 | 0 |
| 1995 | 39 | 0 |
| 1996 | 36 | 0 |
| 1997 | 48 | 0 |
| 1998 | 64 | 0 |
| 1999 | 74 | 0 |
| 2000 | 92 | 0 |
| 2001 | 115 | 41 |
| 2002 | 103 | 94 |
| 2003 | 81 | 64 |
| 2004 | 71 | 64 |
| 2005 | 67 | 76 |
| 2006 | 82 | 123 |
| 2007 | 66 | 164 |
| 2008 | 97 | 205 |
| 2009 | 109 | 224 |
| 2010 | 175 | 229 |
| 2011 | 176 | 249 |
| 2012 | 186 | 303 |
| 2013 | 256 | 407 |
| 2014 | 354 | 526 |
| 2015 | 447 | 659 |
| 2016 | 520 | 554 |
| 2017 | 616 | 588 |
| 2018 | 526 | 578 |
| 2019 | 567 | 597 |
| 2020 | 594 | 620 |
| 2021 | 496 | 525 |
| 2022 | 405 | 607 |
| 2023 | 460 | 606 |
| 2024 | 483 | 596 |
| 2025 | 421 | 544 |
| 2026 | 278 | 467 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method of manufacturing a redistribution layer, redistribution layer, integrated circuit and methods for electrically testing and protecting the integrated circuit6 Oct 2026US 12,753,493 B2STMicroelectronics S,r.l.
- Method for fabricating a semiconductor device using a wafer inspection apparatus6 Oct 2026US 12,757,687 B2Samsung Electronics Co., Ltd.
- Light irradiation type heat treatment method and heat treatment apparatus29 Sep 2026US 12,751,237 B2SCREEN Holdings Co., Ltd.
- Cylindric decomposition for efficient mitigation of substrate deformation with film deposition and ion implantation29 Sep 2026US 12,751,253 B2APPLIED Materials.Inc.
- Carrier-resolved hall measurement with multi-harmonic magnetoresistance analysis22 Sep 2026US 12,742,812 B2International Business Machines Corporation
- Surface inspection tool for transfer tools and methods of using the same8 Oct 2026US 2026/0309645 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Wafer release mechanism8 Oct 2026US 2026/0314329 A1Taiwan Semiconductor Manufacturing Company.Ltd
- System and method for detecting semiconductor processing error8 Oct 2026US 2026/0314334 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Machine learning-based product test-time reduction for test flow, manufacture, design, and operation of integrated-circuit devices8 Oct 2026US 2026/0314335 A1NXP B. V.
- Substrate production method and chip production method8 Oct 2026US 2026/0314344 A1Disco Corporation
Most cited
By later US patents
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Stacked semiconductor devices and methods of forming same1,870US 9,496,189 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Semiconductor device dielectric interface layer544US 8,728,832 B2ASM IP Holdings B.V. · 2014
- Semiconductor device dielectric interface layer508US 9,177,784 B2ASM IP Holdings B.V. · 2015
- Soft landing nanolaminates for advanced patterning505US 9,390,909 B2Novellus Systems, Inc. · 2016