H10P 74/207
Electrical properties
Official title: {Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics}
H10P74/207 (Electrical properties) appears on 2,541 US grants and 3,045 published applications in this corpus.
Search patents in H10P- Granted patents
- 2,541
- Published applications
- 3,045
- Assignees
- 727
- Inventors
- 5,725
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 3 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 4 | 0 |
| 1989 | 3 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 3 | 0 |
| 1994 | 5 | 0 |
| 1995 | 10 | 0 |
| 1996 | 16 | 0 |
| 1997 | 12 | 0 |
| 1998 | 14 | 0 |
| 1999 | 12 | 0 |
| 2000 | 19 | 0 |
| 2001 | 22 | 4 |
| 2002 | 19 | 13 |
| 2003 | 21 | 18 |
| 2004 | 12 | 11 |
| 2005 | 16 | 18 |
| 2006 | 19 | 24 |
| 2007 | 18 | 50 |
| 2008 | 26 | 68 |
| 2009 | 40 | 78 |
| 2010 | 58 | 59 |
| 2011 | 55 | 81 |
| 2012 | 53 | 87 |
| 2013 | 58 | 131 |
| 2014 | 126 | 183 |
| 2015 | 137 | 246 |
| 2016 | 210 | 189 |
| 2017 | 236 | 221 |
| 2018 | 188 | 200 |
| 2019 | 201 | 195 |
| 2020 | 182 | 204 |
| 2021 | 171 | 156 |
| 2022 | 124 | 166 |
| 2023 | 140 | 162 |
| 2024 | 130 | 143 |
| 2025 | 105 | 148 |
| 2026 | 62 | 190 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of manufacturing a redistribution layer, redistribution layer, integrated circuit and methods for electrically testing and protecting the integrated circuit6 Oct 2026US 12,753,493 B2STMicroelectronics S,r.l.
- Carrier-resolved hall measurement with multi-harmonic magnetoresistance analysis22 Sep 2026US 12,742,812 B2International Business Machines Corporation
- Method of manufacturing light emitting device22 Sep 2026US 12,745,605 B2Nichia Corporation
- Method and apparatus for silicon photonics testing1 Sep 2026US 12,723,947 B2Marvell Asia Pte Ltd
- Semiconductor package including a pad comprising a connection portion connecting a first and second pad portions1 Sep 2026US 12,727,496 B2Samsung Electronics Co., Ltd.
- Machine learning-based product test-time reduction for test flow, manufacture, design, and operation of integrated-circuit devices8 Oct 2026US 2026/0314335 A1NXP B. V.
- Method of matching multiple chips for forming a system-on-integrated-chips1 Oct 2026US 2026/0300589 A1Mediatek Inc.
- Vibration isolation layers, measurement systems that include the vibration isolation layers, and related methods24 Sep 2026US 2026/0287616 A9FormFactor, Inc.
- Substrate processing17 Sep 2026US 2026/0282845 A1ASML Netherlands B. V.
- Method of forming a chiplet device prototype17 Sep 2026US 2026/0283017 A1Microchip Technology Incorporated
Most cited
By later US patents
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Stacked semiconductor devices and methods of forming same1,870US 9,496,189 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Methods and systems for predicting IC chip yield182US 6,751,519 B1KLA-Tencor Technologies Corporation · 2004
- Semiconductor chip repair by stacking of a base semiconductor chip and a repair semiconductor chip182US 8,679,861 B2International Business Machines Corporation · 2014
- Systems and methods for efficient transfer of semiconductor elements171US 10,446,532 B2Invensas Bonding Technologies, Inc. · 2019