Methods and systems for predicting IC chip yield

A computer program product for managing and predicting product yield for a plurality of semiconductor products, the computer program product comprising:

• at least one computer readable medium;
• computer program instructions stored within the at least one computer readable product configured to:
• after a first process is performed on a particular semiconductor product, receive yield information related to a test structure yield for the first process, wherein a subsequent process remains to be performed on the particular semiconductor product;
• and
• predict a product yield of the semiconductor product at a time of fabrication completion, wherein the prediction is dynamically determined by combining the obtained yield information for the first process with at least an average of yield information obtained from a plurality of times for which the subsequent process was previously performed on a plurality of previously fabricated semiconductor products.

A yield management system for managing and predicting product yield for a plurality of semiconductor products, the system comprising:

• one or more processors;
• one or more memory, wherein at least one of the processors and memory are adapted to:
• after a first process is performed on a particular semiconductor product, receive yield information related to a test structure yield for the first process, wherein a subsequent process remains to be performed on the particular semiconductor product;
• and
• predict a product yield of the semiconductor product at a time of fabrication completion, wherein the prediction is dynamically determined by combining the obtained yield information for the first process with at least an average of yield information obtained from a plurality of times for which the subsequent process was previously performed on a plurality of previously fabricated semiconductor products.