Method and apparatus for silicon photonics testing
AssigneeMarvell Asia Pte Ltd
InventorsAndrew Yick, Masaki Kato
Life of this patent
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Abstract
A first photonics integrated circuit (PIC) chip originates from a PIC wafer. The first PIC chip includes a substrate, and one or more optical communication components fabricated on the substrate. Optical testing components are also fabricated on the substrate. The optical testing components are configured to, prior to die singulation of the PIC wafer, transfer light to a second PIC chip on the PIC wafer for testing one or more operational attributes of optical components disposed on the second PIC chip Prior to die singulation of the PIC wafer, the second PIC chip was adjacent to the first PIC chip on the PIC wafer.
Claims25
A first photonics integrated circuit (PIC) chip, the first PIC chip having originated from a PIC wafer, the first PIC chip comprising:
- a substrate;
- one or more optical communication components fabricated on the substrate, the one or more optical components including i) at least one optical modulator, and ii) at least one first edge coupler configured to output modulated light from the at least one optical modulator, the at least one first edge coupler located at one or more edges of the first PIC chip;
- and
- optical testing components fabricated on the substrate, the optical testing components including:
- a second edge coupler located at a first edge of the first PIC chip, the second edge coupler configured to, prior to die singulation of the PIC wafer, transfer light to a second PIC chip on the PIC wafer for testing at least a first operational attribute among operational attributes of optical components disposed on the second PIC chip, wherein the second PIC chip was adjacent to the first PIC chip on the PIC wafer prior to die singulation of the PIC wafer.
A method for manufacturing photonics integrated circuit (PIC) chips, the method comprising:
- fabricating a plurality of PIC chips on a PIC wafer having a substrate, including, for each PIC chip among multiple PIC chips of the PIC wafer:
- fabricating on the substrate one or more optical components and one or more electrical components corresponding to at least one of i) an optical communication transmitter, and ii) an optical communication receiver, the one or more optical components including i) at least one optical modulator, and ii) at least one first edge coupler configured to output modulated light from the at least one optical modulator, the at least one first edge coupler located at one or more edges of the first PIC chip, and
- fabricating on the substrate testing components distinct from the one or more optical components and the one or more electrical components corresponding to the at least one of i) the optical communication transmitter, and ii) the optical communication receiver, the testing components configured to, while the PIC chip and another PIC chip adjacent to the PIC chip are integral with the PIC wafer, transfer light to the other PIC chip for testing one or more operational attributes of optical components disposed on the other PIC chip, the fabricating of the testing components including:
- fabricating a second edge coupler on the substrate located at a first edge of the first PIC chip, the second edge coupler configured to, prior to die singulation of the PIC wafer, transfer light to the other PIC chip for testing at least a first operational attribute among the one or more operational attributes of the optical components disposed on the other PIC chip.
Dependencies are inferred from the claim text.