Method of manufacturing a redistribution layer, redistribution layer, integrated circuit and methods for electrically testing and protecting the integrated circuit
AssigneeSTMicroelectronics S.r.l.
InventorsSamuele Sciarrillo, Paolo Colpani
Life of this patent
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Abstract
To manufacture a redistribution layer for an integrated circuit, a first insulating layer is formed on a conductive interconnection layer of a wafer. A conductive body is then formed in electrical contact with the interconnection layer. The conductive body is then covered with an insulating region having an aperture that exposes a surface of the conductive body. The surface of the conductive body and the insulating region are then covered with an insulating protection layer having a thickness less than 100 nm. This insulating protection layer is configured to provide a protection against oxidation and/or corrosion of the conductive body.
Claims18
A method of manufacturing a redistribution layer for an integrated circuit, comprising the steps of:
- forming a first insulating layer on a conductive interconnection layer of a wafer;
- forming a conductive body in electrical contact with the conductive interconnection layer;
- covering the conductive body with an insulating region having an aperture that exposes a surface of the conductive body;
- covering the surface of the conductive body and the insulating region with an insulating dielectric protection layer having a thickness less than 100 nm and configured to provide a protection against one or more of oxidation and corrosion of the conductive body.
Dependencies are inferred from the claim text.