H10P 74/203
Structural properties
Official title: {Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects}
H10P74/203 (Structural properties) appears on 5,693 US grants and 6,845 published applications in this corpus.
Search patents in H10P- Granted patents
- 5,693
- Published applications
- 6,845
- Assignees
- 1,181
- Inventors
- 12,926
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 3 | 0 |
| 1982 | 1 | 0 |
| 1983 | 3 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 6 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 9 | 0 |
| 1993 | 12 | 0 |
| 1994 | 16 | 0 |
| 1995 | 29 | 0 |
| 1996 | 22 | 0 |
| 1997 | 36 | 0 |
| 1998 | 50 | 0 |
| 1999 | 65 | 0 |
| 2000 | 74 | 0 |
| 2001 | 92 | 37 |
| 2002 | 85 | 79 |
| 2003 | 61 | 46 |
| 2004 | 57 | 50 |
| 2005 | 49 | 55 |
| 2006 | 59 | 92 |
| 2007 | 44 | 109 |
| 2008 | 66 | 130 |
| 2009 | 71 | 155 |
| 2010 | 118 | 163 |
| 2011 | 122 | 160 |
| 2012 | 129 | 214 |
| 2013 | 184 | 252 |
| 2014 | 209 | 339 |
| 2015 | 301 | 399 |
| 2016 | 306 | 363 |
| 2017 | 365 | 375 |
| 2018 | 336 | 379 |
| 2019 | 373 | 421 |
| 2020 | 420 | 449 |
| 2021 | 357 | 388 |
| 2022 | 293 | 463 |
| 2023 | 344 | 461 |
| 2024 | 373 | 467 |
| 2025 | 333 | 417 |
| 2026 | 212 | 382 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for fabricating a semiconductor device using a wafer inspection apparatus6 Oct 2026US 12,757,687 B2Samsung Electronics Co., Ltd.
- Light irradiation type heat treatment method and heat treatment apparatus29 Sep 2026US 12,751,237 B2SCREEN Holdings Co., Ltd.
- Cylindric decomposition for efficient mitigation of substrate deformation with film deposition and ion implantation29 Sep 2026US 12,751,253 B2APPLIED Materials.Inc.
- In situ film growth sensor assembly, apparatus, and methods22 Sep 2026US 12,745,604 B2APPLIED Materials.Inc.
- Method and apparatus for inspection and metrology15 Sep 2026US 12,737,430 B2ASML Netherlands B. V.
- Surface inspection tool for transfer tools and methods of using the same8 Oct 2026US 2026/0309645 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate production method and chip production method8 Oct 2026US 2026/0314344 A1Disco Corporation
- Method and system for measuring and correcting die alignment error1 Oct 2026US 2026/0298625 A1
- Radiation temperature measurement device, radiation temperature measurement method, and program for radiation temperature measurement device1 Oct 2026US 2026/0298714 A1Horiba, Ltd.
- Non-destructive inspection method including inspecting multiple observation sites and method of manufacturing semiconductor memory device using the same1 Oct 2026US 2026/0298804 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Semiconductor device dielectric interface layer544US 8,728,832 B2ASM IP Holdings B.V. · 2014
- Semiconductor device dielectric interface layer508US 9,177,784 B2ASM IP Holdings B.V. · 2015
- Soft landing nanolaminates for advanced patterning505US 9,390,909 B2Novellus Systems, Inc. · 2016
- Flowable carbon for semiconductor processing477US 9,514,932 B2APPLIED Materials.Inc. · 2016
- Apparatus and method for determining wafer temperature using pyrometry475US 5,305,417 ATexas Instruments Incorporated · 1994