Method and system for measuring and correcting die alignment error

A method of correcting an alignment error of a die with respect to a first substrate, the method comprising:

• capturing, by an imaging device, a first image on an object, the first image includes a first metrology mark, the first metrology mark includes a first pattern;
• capturing, by the imaging device, a second image on a surface of the die, the second image includes a second metrology mark, the second metrology mark includes a second pattern captured while the die is moving toward the first substrate;
• superposing the first pattern and the second pattern to form a simulated interference pattern;
• determining a metrology mark error based on the simulated interference pattern in X, Y and θZ directions;
• obtaining the die alignment error based on alignment marks placement error of a second substrate of the die, and the metrology mark error;
• and
• adjusting a position of the die, before the die is brought into contact with the first substrate, based on the die alignment error.

A method of manufacturing an article comprising:

• an alignment method of correcting an alignment error of a die with respect to a first substrate, the alignment method comprising:
• capturing, by an imaging device, a first image on an object, the first image includes a first metrology mark, the first metrology mark includes a first pattern;
• capturing, by the imaging device, a second image on a surface of the die, the second image includes a second metrology mark, the second metrology mark includes a second pattern captured while the die is moving toward the first substrate;
• superposing the first pattern and the second pattern to form a simulated interference pattern;
• determining a metrology mark error based on the simulated interference pattern in X, Y and θZ directions;
• obtaining the die alignment error based on alignment marks placement error of a second substrate of the die, and the metrology mark error;
• and
• adjusting a position of the die, before the die is brought into contact with the first substrate, based on the die alignment error;
• bringing the die into contact with the first substrate;
• and
• processing the first substrate to manufacture the article.