H10P 74/27
Structural arrangements therefor
Official title: {Structural arrangements therefor}
H10P74/27 (Structural arrangements therefor) appears on 5,107 US grants and 5,346 published applications in this corpus.
Search patents in H10P- Granted patents
- 5,107
- Published applications
- 5,346
- Assignees
- 956
- Inventors
- 9,783
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 4 | 0 |
| 1979 | 2 | 0 |
| 1980 | 4 | 0 |
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 4 | 0 |
| 1984 | 7 | 0 |
| 1985 | 4 | 0 |
| 1986 | 2 | 0 |
| 1987 | 5 | 0 |
| 1988 | 5 | 0 |
| 1989 | 11 | 0 |
| 1990 | 10 | 0 |
| 1991 | 14 | 0 |
| 1992 | 11 | 0 |
| 1993 | 19 | 0 |
| 1994 | 23 | 0 |
| 1995 | 21 | 0 |
| 1996 | 22 | 0 |
| 1997 | 58 | 0 |
| 1998 | 58 | 0 |
| 1999 | 94 | 0 |
| 2000 | 97 | 0 |
| 2001 | 97 | 50 |
| 2002 | 133 | 110 |
| 2003 | 155 | 149 |
| 2004 | 163 | 159 |
| 2005 | 151 | 183 |
| 2006 | 145 | 168 |
| 2007 | 121 | 123 |
| 2008 | 96 | 169 |
| 2009 | 82 | 162 |
| 2010 | 150 | 136 |
| 2011 | 122 | 152 |
| 2012 | 123 | 151 |
| 2013 | 144 | 193 |
| 2014 | 178 | 247 |
| 2015 | 230 | 249 |
| 2016 | 231 | 226 |
| 2017 | 293 | 255 |
| 2018 | 264 | 252 |
| 2019 | 265 | 277 |
| 2020 | 268 | 279 |
| 2021 | 240 | 259 |
| 2022 | 201 | 302 |
| 2023 | 215 | 309 |
| 2024 | 244 | 263 |
| 2025 | 181 | 254 |
| 2026 | 135 | 269 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor test apparatus6 Oct 2026US 12,754,228 B2Samsung Electronics Co., Ltd.
- Semiconductor device and method of manufacturing the same6 Oct 2026US 12,757,688 B2SK hynix Inc.
- Memory device package having scribe line and method for manufacturing the same6 Oct 2026US 12,757,742 B2Nanya Technology Corporation
- Semiconductor chip with stepped sidewall, semiconductor package including the same, and method of fabricating the same29 Sep 2026US 12,751,277 B2Samsung Electronics Co., Ltd.
- Carrier-resolved hall measurement with multi-harmonic magnetoresistance analysis22 Sep 2026US 12,742,812 B2International Business Machines Corporation
- Surface inspection tool for transfer tools and methods of using the same8 Oct 2026US 2026/0309645 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device and method of monitoring process defects of semiconductor device8 Oct 2026US 2026/0314337 A1SK hynix Inc.
- Semiconductor devices having crack detection structure8 Oct 2026US 2026/0314338 A1Samsung Electronics Co., Ltd.
- Non-destructive inspection method including inspecting multiple observation sites and method of manufacturing semiconductor memory device using the same1 Oct 2026US 2026/0298804 A1Samsung Electronics Co., Ltd.
- Voltage contrast for backside processes on wafers1 Oct 2026US 2026/0299019 A1Intel Corporation
Most cited
By later US patents
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Stacked semiconductor devices and methods of forming same1,870US 9,496,189 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Semiconductor chip assemblies with fan-in leads734US 5,148,265 AIST Associates, Inc. · 1992
- Semiconductor chip assemblies having interposer and flexible lead719US 5,148,266 AIST Associates, Inc. · 1992